Assembly method of electronic device
AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorI-Kai Liang
Life of this patent
Estimating the term…
Abstract
The present disclosure provides an assembly method of an electronic device. The assembly method includes: opening an upper cover of a loading mechanism on a circuit board, in which the upper cover has an opening, and when the upper cover is in a closed state, the opening exposes a central processing unit socket located on the circuit board; snapping an elastic sheet to opposite sides of an inner edge of the opening of the upper cover through buckling portion of the elastic sheet; and closing the upper cover of the loading mechanism so that an elastic sheet body of the elastic sheet covers the central processing unit socket.
Claims20
An assembly method of an electronic device, comprising:
- opening an upper cover of a loading mechanism on a circuit board, wherein the upper cover has an opening, and when the upper cover is in a closed state, the opening exposes a central processing unit socket located on the circuit board;
- snapping an elastic sheet to opposite sides of an inner edge of the opening of the upper cover through buckling portions of the elastic sheet;
- and
- closing the upper cover of the loading mechanism so that an elastic sheet body of the elastic sheet covers the central processing unit socket.
Dependencies are inferred from the claim text.