Systems and methods for test sockets having scrubbing contacts

A method for assembling a test system for a semiconductor integrated circuit (IC), said method comprising:

• positioning a socket body configured to engage the semiconductor IC and a load board adjacent to a top surface of an elastomer retainer, the top surface configured to face the semiconductor IC, the elastomer retainer further including a bottom surface, opposite the top surface, configured to face the load board, the elastomer retainer defining a slot extending from the top surface to the bottom surface;
• and
• positioning a rotational contact in the slot, the rotational contact configured to move between a free state and a pre-load state, and to move between the pre-load state and a loaded state, wherein the elastomer retainer is configured to compress under a pre-load force from the rotational contact when moving from the free state to the pre-load state upon engagement of the socket body with the load board, and compress under a loading force from the rotational contact when moving from the pre-load state to the loaded state upon engagement of the socket body with the semiconductor IC.