Methods and apparatus to improve thermal dissipation and mechanical loading of integrated circuit packages
AssigneeIntel Corporation
InventorsKyle Jordan Arrington, Prabhakar Subrahmanyam, Steven Adam Klein, Kelly Porter Lofgreen, Joseph Blane Petrini
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Abstract
Systems, apparatus, articles of manufacture, and methods to improve thermal dissipation and mechanical loading of integrated circuit packages are disclosed. An example apparatus includes: a socket to receive an integrated circuit package; and a plate to apply a load on the integrated circuit package towards the socket. The plate includes an internal channel to carry a coolant through the plate. The liquid coolant is to facilitate cooling of the integrated circuit package.
Claims21
An apparatus comprising:
- a socket to receive an integrated circuit package;
- and
- a plate to apply a load on the integrated circuit package towards the socket, the plate including an internal channel to carry a liquid coolant through the plate, the liquid coolant to facilitate cooling of the integrated circuit package.
An apparatus comprising:
- a load block removably couplable to an integrated circuit package, the load block to generate a load that presses against the integrated circuit package, the load block including a fluid channel to carry a liquid therethrough, the liquid to facilitate cooling of the integrated circuit package;
- and
- a gasket to be compressed between the load block and the integrated circuit package.
An apparatus comprising:
- a plate including at least one of (i) microchannels through which a coolant is to pass to draw away heat from the plate that is thermally coupled to an integrated circuit package or (ii) an array of nozzles to directly impinge the coolant onto the integrated circuit package;
- and
- a spring to urge the plate against the integrated circuit package.
(canceled)
Dependencies are inferred from the claim text.