H05K 7/1053
Having interior leads
Official title: {having interior leads}
H05K7/1053 (Having interior leads) appears on 1,802 US grants and 1,133 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,802
- Published applications
- 1,133
- Assignees
- 379
- Inventors
- 1,853
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 15 | 0 |
| 1977 | 11 | 0 |
| 1978 | 4 | 0 |
| 1979 | 7 | 0 |
| 1980 | 8 | 0 |
| 1981 | 6 | 0 |
| 1982 | 14 | 0 |
| 1983 | 13 | 0 |
| 1984 | 18 | 0 |
| 1985 | 34 | 0 |
| 1986 | 21 | 0 |
| 1987 | 32 | 0 |
| 1988 | 13 | 0 |
| 1989 | 18 | 0 |
| 1990 | 17 | 0 |
| 1991 | 39 | 0 |
| 1992 | 29 | 0 |
| 1993 | 29 | 0 |
| 1994 | 32 | 0 |
| 1995 | 32 | 0 |
| 1996 | 30 | 0 |
| 1997 | 43 | 0 |
| 1998 | 53 | 0 |
| 1999 | 38 | 0 |
| 2000 | 63 | 0 |
| 2001 | 63 | 18 |
| 2002 | 52 | 41 |
| 2003 | 48 | 62 |
| 2004 | 76 | 68 |
| 2005 | 71 | 128 |
| 2006 | 93 | 72 |
| 2007 | 88 | 82 |
| 2008 | 77 | 115 |
| 2009 | 88 | 95 |
| 2010 | 102 | 79 |
| 2011 | 75 | 39 |
| 2012 | 46 | 43 |
| 2013 | 29 | 36 |
| 2014 | 30 | 36 |
| 2015 | 39 | 16 |
| 2016 | 24 | 18 |
| 2017 | 21 | 19 |
| 2018 | 21 | 26 |
| 2019 | 24 | 33 |
| 2020 | 26 | 16 |
| 2021 | 17 | 25 |
| 2022 | 26 | 23 |
| 2023 | 11 | 21 |
| 2024 | 14 | 11 |
| 2025 | 13 | 5 |
| 2026 | 9 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Shielded socket pin for device-to-device connection11 Aug 2026US 12,706,407 B2Intel Corporation
- Differential transmission board set and assembly9 Jun 2026US 12,652,773 B2Japan Aviation Electronics Industry, Limited
- Socket including a housing and a plurality of contacts2 Jun 2026US 12,648,099 B2Te Connectivity Japan G.K.
- Differential transmission board set and assembly19 May 2026US 12,635,099 B2Japan Aviation Electronics Industry, Limited
- Differential transmission board set and assembly12 May 2026US 12,628,300 B2Japan Aviation Electronics Industry, Limited
- Electronic assembly including a connecting fork13 Aug 2026US 2026/0239586 A1Valeo eAutomotive Germany GmbH
- Conductive polymer enhanced socket30 Apr 2026US 2026/0122814 A1Advanced Micro Devices, Inc.
- Electrical connector16 Apr 2026US 2026/0106391 A1Sichuan Huafeng Technology Co., Ltd.
- Socket assemblies for semiconductor devices26 Mar 2026US 2026/0086114 A1Intel Corporation
- Shielding shell assembly, connector and electronic product19 Mar 2026US 2026/0082529 A1Tyco Electronics AMP Qingdao Ltd.
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007