H05K 7/1061
Co-operating by abutting
Official title: {co-operating by abutting}
H05K7/1061 (Co-operating by abutting) appears on 1,205 US grants and 790 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,205
- Published applications
- 790
- Assignees
- 265
- Inventors
- 1,340
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 8 | 0 |
| 1978 | 2 | 0 |
| 1979 | 6 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 12 | 0 |
| 1983 | 9 | 0 |
| 1984 | 10 | 0 |
| 1985 | 21 | 0 |
| 1986 | 12 | 0 |
| 1987 | 21 | 0 |
| 1988 | 8 | 0 |
| 1989 | 11 | 0 |
| 1990 | 9 | 0 |
| 1991 | 19 | 0 |
| 1992 | 16 | 0 |
| 1993 | 16 | 0 |
| 1994 | 18 | 0 |
| 1995 | 16 | 0 |
| 1996 | 11 | 0 |
| 1997 | 24 | 0 |
| 1998 | 33 | 0 |
| 1999 | 29 | 0 |
| 2000 | 41 | 0 |
| 2001 | 46 | 16 |
| 2002 | 34 | 34 |
| 2003 | 38 | 48 |
| 2004 | 59 | 47 |
| 2005 | 50 | 84 |
| 2006 | 61 | 53 |
| 2007 | 61 | 54 |
| 2008 | 59 | 79 |
| 2009 | 64 | 59 |
| 2010 | 51 | 45 |
| 2011 | 50 | 29 |
| 2012 | 33 | 26 |
| 2013 | 16 | 26 |
| 2014 | 24 | 22 |
| 2015 | 22 | 13 |
| 2016 | 20 | 15 |
| 2017 | 18 | 17 |
| 2018 | 18 | 19 |
| 2019 | 18 | 26 |
| 2020 | 20 | 8 |
| 2021 | 11 | 19 |
| 2022 | 19 | 16 |
| 2023 | 10 | 16 |
| 2024 | 12 | 9 |
| 2025 | 12 | 4 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Shielded socket pin for device-to-device connection11 Aug 2026US 12,706,407 B2Intel Corporation
- Differential transmission board set and assembly9 Jun 2026US 12,652,773 B2Japan Aviation Electronics Industry, Limited
- Socket including a housing and a plurality of contacts2 Jun 2026US 12,648,099 B2Te Connectivity Japan G.K.
- Differential transmission board set and assembly19 May 2026US 12,635,099 B2Japan Aviation Electronics Industry, Limited
- Differential transmission board set and assembly12 May 2026US 12,628,300 B2Japan Aviation Electronics Industry, Limited
- Electronic assembly including a connecting fork13 Aug 2026US 2026/0239586 A1Valeo eAutomotive Germany GmbH
- Conductive polymer enhanced socket30 Apr 2026US 2026/0122814 A1Advanced Micro Devices, Inc.
- Electrical connector16 Apr 2026US 2026/0106391 A1Sichuan Huafeng Technology Co., Ltd.
- Socket assemblies for semiconductor devices26 Mar 2026US 2026/0086114 A1Intel Corporation
- Shielding shell assembly, connector and electronic product19 Mar 2026US 2026/0082529 A1Tyco Electronics AMP Qingdao Ltd.
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007