H05K 7/1069
With spring contact pieces
Official title: {with spring contact pieces}
H05K7/1069 (With spring contact pieces) appears on 583 US grants and 359 published applications in this corpus.
Search patents in H05K- Granted patents
- 583
- Published applications
- 359
- Assignees
- 149
- Inventors
- 630
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 5 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 10 | 0 |
| 1983 | 5 | 0 |
| 1984 | 6 | 0 |
| 1985 | 17 | 0 |
| 1986 | 7 | 0 |
| 1987 | 8 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 6 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 10 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 7 | 0 |
| 1997 | 12 | 0 |
| 1998 | 21 | 0 |
| 1999 | 17 | 0 |
| 2000 | 18 | 0 |
| 2001 | 33 | 13 |
| 2002 | 13 | 14 |
| 2003 | 16 | 15 |
| 2004 | 19 | 18 |
| 2005 | 22 | 42 |
| 2006 | 29 | 30 |
| 2007 | 38 | 31 |
| 2008 | 20 | 24 |
| 2009 | 31 | 24 |
| 2010 | 20 | 20 |
| 2011 | 26 | 15 |
| 2012 | 13 | 12 |
| 2013 | 4 | 17 |
| 2014 | 13 | 7 |
| 2015 | 13 | 3 |
| 2016 | 8 | 7 |
| 2017 | 6 | 5 |
| 2018 | 10 | 9 |
| 2019 | 9 | 13 |
| 2020 | 9 | 3 |
| 2021 | 4 | 8 |
| 2022 | 7 | 9 |
| 2023 | 5 | 11 |
| 2024 | 7 | 6 |
| 2025 | 9 | 2 |
| 2026 | 6 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Shielded socket pin for device-to-device connection11 Aug 2026US 12,706,407 B2Intel Corporation
- Differential transmission board set and assembly9 Jun 2026US 12,652,773 B2Japan Aviation Electronics Industry, Limited
- Socket including a housing and a plurality of contacts2 Jun 2026US 12,648,099 B2Te Connectivity Japan G.K.
- Differential transmission board set and assembly19 May 2026US 12,635,099 B2Japan Aviation Electronics Industry, Limited
- Differential transmission board set and assembly12 May 2026US 12,628,300 B2Japan Aviation Electronics Industry, Limited
- Conductive polymer enhanced socket30 Apr 2026US 2026/0122814 A1Advanced Micro Devices, Inc.
- Connector including signal pins shielded by buried ground vias17 Apr 2025US 2025/0125546 A1Neoconix, Inc.
- Small form factor shunted socket pins and configuration for improved single ended signaling9 Jan 2025US 2025/0015527 A1Intel Corporation
- Connector including signal pins shielded by buried ground vias23 May 2024US 2024/0170867 A1Neoconix, Inc.
- Differential transmission board set and assembly7 Mar 2024US 2024/0079806 A1Japan Aviation Electronics Industry, Limited
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002