Connector including signal pins shielded by buried ground vias

A connector for electrically connecting to conductive structures formed on an electronic component, comprising:

• a core comprising an isolation layer and a plurality of signal vias and a plurality of ground vias formed in the isolation layer and arranged in a two-dimensional array;
• a first ground plane formed on or in the core and electrically connected to the plurality of ground vias;
• a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form a first set of signal pins, each signal via and each contact element in the first set being electrically isolated from the first ground plane;
• and
• a second set of contact elements formed on the first surface of the core and electrically connected to a subset of the plurality of ground vias to form a second set of ground pins, remaining ground vias without contact elements connected thereto forming a set of buried ground vias,
• wherein each signal pin in the first set of signal pins is arranged between adjacent buried ground vias in a first direction of the two-dimensional array.