H05K 7/1015
Having exterior leads
Official title: {having exterior leads}
H05K7/1015 (Having exterior leads) appears on 483 US grants and 97 published applications in this corpus.
Search patents in H05K- Granted patents
- 483
- Published applications
- 97
- Assignees
- 166
- Inventors
- 583
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 11 | 0 |
| 1978 | 7 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 9 | 0 |
| 1984 | 7 | 0 |
| 1985 | 16 | 0 |
| 1986 | 6 | 0 |
| 1987 | 16 | 0 |
| 1988 | 18 | 0 |
| 1989 | 11 | 0 |
| 1990 | 15 | 0 |
| 1991 | 25 | 0 |
| 1992 | 31 | 0 |
| 1993 | 27 | 0 |
| 1994 | 38 | 0 |
| 1995 | 24 | 0 |
| 1996 | 26 | 0 |
| 1997 | 28 | 0 |
| 1998 | 26 | 0 |
| 1999 | 16 | 0 |
| 2000 | 12 | 0 |
| 2001 | 6 | 2 |
| 2002 | 10 | 13 |
| 2003 | 8 | 9 |
| 2004 | 9 | 6 |
| 2005 | 6 | 4 |
| 2006 | 4 | 3 |
| 2007 | 2 | 1 |
| 2008 | 1 | 5 |
| 2009 | 1 | 2 |
| 2010 | 1 | 7 |
| 2011 | 6 | 5 |
| 2012 | 1 | 2 |
| 2013 | 2 | 2 |
| 2014 | 0 | 4 |
| 2015 | 2 | 3 |
| 2016 | 5 | 6 |
| 2017 | 1 | 2 |
| 2018 | 6 | 4 |
| 2019 | 7 | 3 |
| 2020 | 1 | 1 |
| 2021 | 2 | 1 |
| 2022 | 2 | 2 |
| 2023 | 1 | 4 |
| 2024 | 1 | 3 |
| 2025 | 3 | 3 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- LGA socket pins for improved differential signaling performance24 Feb 2026US 12,563,686 B2Intel Corporation
- Power module for vehicle and motor driving apparatus including the same20 Jan 2026US 12,528,362 B2Hyundai Motor Company
- Removable OCP module with PCIe slots28 Oct 2025US 12,457,700 B2Hewlett Packard Enterprise Development LP
- Carrier module apparatus for retrofit in control cabinets and methods of assembly thereof22 Jul 2025US 12,369,267 B2ABB Schweiz AG
- Leaded semiconductor device package having leads with different widths17 Jun 2025US 12,334,417 B2Texas Instruments Incorporated
- Mixed height contacts for strategic enabling of high-speed systems through a socket using an interconnect layer25 Sep 2025US 2025/0301588 A1Intel Corporation
- Removable ocp module with pcie slots21 Aug 2025US 2025/0267815 A1Hewlett Packard Enterprise Development LP
- Power module for vehicle and motor driving apparatus including the same27 Feb 2025US 2025/0065728 A1Hyundai Motor Company
- Power module for vehicle and motor driving apparatus including the same18 Apr 2024US 2024/0123835 A1Hyundai Motor Company
- Vertical tray storage system with internal electrical power distribution system11 Apr 2024US 2024/0116714 A1
Most cited
By later US patents
- Through hole mounting of integrated circuit adapter leads194US 5,118,298 AAdvanced Interconnections Corporation · 1992
- Integrated circuit adapter having gullwing-shaped leads181US 5,151,039 AAdvanced Interconnections Corporation · 1992
- Adapter for connection of an integrated circuit package to a circuit board138US 5,168,432 AAdvanced Interconnections Corporation · 1992
- Carrier and test socket for leadless integrated circuit110US 4,329,642 ASiliconix Incorporated · 1982
- Socket for stacking integrated circuit packages108US 4,696,525 AAMP Incorporated · 1987