H05K 7/1023
Co-operating by abutting
Official title: {co-operating by abutting, e.g. flat pack}
H05K7/1023 (Co-operating by abutting) appears on 293 US grants and 50 published applications in this corpus.
Search patents in H05K- Granted patents
- 293
- Published applications
- 50
- Assignees
- 97
- Inventors
- 324
- Latest grant
- 14 Jun 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 11 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 16 | 0 |
| 1992 | 17 | 0 |
| 1993 | 17 | 0 |
| 1994 | 34 | 0 |
| 1995 | 22 | 0 |
| 1996 | 21 | 0 |
| 1997 | 22 | 0 |
| 1998 | 22 | 0 |
| 1999 | 12 | 0 |
| 2000 | 11 | 0 |
| 2001 | 5 | 2 |
| 2002 | 7 | 12 |
| 2003 | 8 | 8 |
| 2004 | 8 | 4 |
| 2005 | 5 | 3 |
| 2006 | 1 | 2 |
| 2007 | 1 | 1 |
| 2008 | 1 | 2 |
| 2009 | 1 | 0 |
| 2010 | 0 | 4 |
| 2011 | 4 | 2 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 2 |
| 2018 | 3 | 1 |
| 2019 | 4 | 2 |
| 2020 | 0 | 1 |
| 2021 | 2 | 0 |
| 2022 | 1 | 1 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Contact arrangement, circuit board, and electronic assembly14 Jun 2022US 11,362,464 B2Shanghai Zhaoxin Semiconductor Co., Ltd.
- ID chip socket for test connector assembly, test connector assembly including ID chip socket, and test equipment set including test connector assembly27 Jul 2021US 11,073,536 B2Isc Co., Ltd.
- Selectively geometric shaped contact pin for electronic component testing and method of fabrication8 Jun 2021US 11,029,335 B1Johnstech International Corporation
- Socket24 Dec 2019US 10,517,186 B2Sensata Technologies, Inc.
- IC socket3 Dec 2019US 10,498,083 B2Toshiba Memory Corporation
- Mixed height contacts for strategic enabling of high-speed systems through a socket using an interconnect layer25 Sep 2025US 2025/0301588 A1Intel Corporation
- Low profile impedance-tunable and cross-talk controlled high speed hybrid socket interconnect28 Sep 2023US 2023/0307856 A1Intel Corporation
- Contact arrangement, circuit board, and electronic assembly17 Feb 2022US 2022/0052489 A1Shanghai Zhaoxin Semiconductor Co., Ltd.
- Id chip socket for test connector assembly, test connector assembly including id chip socket, and test equipment set including test connector assembly14 May 2020US 2020/0150148 A1Isc Co., Ltd.
- Ic socket18 Jul 2019US 2019/0221971 A1Toshiba Memory Corporation
Most cited
By later US patents
- Through hole mounting of integrated circuit adapter leads194US 5,118,298 AAdvanced Interconnections Corporation · 1992
- Integrated circuit adapter having gullwing-shaped leads181US 5,151,039 AAdvanced Interconnections Corporation · 1992
- Adapter for connection of an integrated circuit package to a circuit board138US 5,168,432 AAdvanced Interconnections Corporation · 1992
- Carrier and test socket for leadless integrated circuit110US 4,329,642 ASiliconix Incorporated · 1982
- Electrical connecting apparatus for electrically connecting a device to be tested88US 6,019,612 AKabushiki Kaisha Nihon Micronics · 2000