Back to results
US 2023/0307856 A1Published application
Low profile impedance-tunable and cross-talk controlled high speed hybrid socket interconnect
AssigneeIntel Corporation
InventorsEmad S. AL-MOMANI, Ismael FRANCO NÚÑEZ
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein include sockets and socket architectures. In an embodiment, a socket comprises a substrate. In an embodiment, an opening is provided through the substrate. In an embodiment, an elastomeric pin inserted into the opening. In an embodiment, the elastomeric pin is electrically conductive.
Claims25
A socket, comprising:
- a substrate;
- an opening through the substrate;
- and
- an elastomeric pin inserted into the opening, wherein the elastomeric pin is electrically conductive.
1 more element
A socket, comprising:
- a substrate with a first surface and a second surface opposite from the first surface;
- a first blind recess into the first surface of the substrate;
- a second blind recess into the second surface of the substrate;
- a first elastomeric pin inserted into the first blind recess;
- and
- a second elastomeric pin inserted into the second blind recess, wherein the first and second elastomeric pins are electrically conductive.
3 more elements
An electronic system, comprising:
- a die;
- a package substrate coupled to the die;
- a socket coupled to the package substrate, wherein the socket comprises:
- compliant pins that pass through a thickness of a socket substrate;
- and
- a board coupled to the socket.
3 more elements
Dependencies are inferred from the claim text.