An electronic assembly, comprising a chip package, a motherboard, and a socket electrical connector installed on the motherboard, wherein the chip package has a surface and a contact arrangement located on the surface, the contact arrangement comprises a plurality of contacts, the plurality of contacts are staggered and are respectively in contact with a plurality of elastic terminals of the socket electrical connector, and each of the plurality of elastic terminals is soldered to the motherboard, wherein a plurality of the plurality of contacts form at least one contact group, and the at least one contact group comprises:
- a pair of first contacts, as a pair of differential signal contacts;
- and
- eight second contacts, arranged around the pair of first contacts, wherein two of the plurality of second contacts are arranged along a straight line perpendicular to a connecting line of the pair of first contacts, and position distribution and electrical properties of the other six of the plurality of second contacts are symmetrical to each other relative to the straight line.