H05K 7/103
Co-operating by sliding
Official title: {co-operating by sliding, e.g. DIP carriers}
H05K7/103 (Co-operating by sliding) appears on 171 US grants and 29 published applications in this corpus.
Search patents in H05K- Granted patents
- 171
- Published applications
- 29
- Assignees
- 77
- Inventors
- 248
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 7 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 9 | 0 |
| 1986 | 1 | 0 |
| 1987 | 12 | 0 |
| 1988 | 7 | 0 |
| 1989 | 8 | 0 |
| 1990 | 8 | 0 |
| 1991 | 9 | 0 |
| 1992 | 13 | 0 |
| 1993 | 9 | 0 |
| 1994 | 6 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 5 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 1 |
| 2005 | 1 | 1 |
| 2006 | 2 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 2 |
| 2011 | 1 | 2 |
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 3 |
| 2015 | 1 | 1 |
| 2016 | 4 | 2 |
| 2017 | 0 | 1 |
| 2018 | 2 | 3 |
| 2019 | 4 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 3 |
| 2024 | 0 | 2 |
| 2025 | 3 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- LGA socket pins for improved differential signaling performance24 Feb 2026US 12,563,686 B2Intel Corporation
- Removable OCP module with PCIe slots28 Oct 2025US 12,457,700 B2Hewlett Packard Enterprise Development LP
- Carrier module apparatus for retrofit in control cabinets and methods of assembly thereof22 Jul 2025US 12,369,267 B2ABB Schweiz AG
- Leaded semiconductor device package having leads with different widths17 Jun 2025US 12,334,417 B2Texas Instruments Incorporated
- Vital relay assembly for modular solid-state current-limiting27 Dec 2022US 11,539,177 B2Siemens Mobility GmbH
- Removable ocp module with pcie slots21 Aug 2025US 2025/0267815 A1Hewlett Packard Enterprise Development LP
- Vertical tray storage system with internal electrical power distribution system11 Apr 2024US 2024/0116714 A1
- Socket interconnect structures and related methods4 Apr 2024US 2024/0113479 A1Intel Corporation
- Carrier module apparatus for retrofit in control cabinets and methods of assembly thereof5 Oct 2023US 2023/0320017 A1ABB Schweiz AG
- Leaded semiconductor device package2 Mar 2023US 2023/0068748 A1Texas Instruments Incorporated
Most cited
By later US patents
- Socket for stacking integrated circuit packages108US 4,696,525 AAMP Incorporated · 1987
- Dual beam connector68US 4,533,187 AAugat Inc. · 1985
- Connector for connecting a circuit element to the surface of a substrate66US 4,089,575 AAMP Incorporated · 1978
- Dual-in-line socket63US 3,989,331 AAugat Inc. · 1976
- Dual-in-line package assembly59US 4,406,508 AThomas & Betts Corporation · 1983