H05K 7/1038
With spring contact pieces
Official title: {with spring contact pieces (H05K7/1046 takes precedence)}
H05K7/1038 (With spring contact pieces) appears on 62 US grants and 12 published applications in this corpus.
Search patents in H05K- Granted patents
- 62
- Published applications
- 12
- Assignees
- 33
- Inventors
- 101
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 6 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 1 | 2 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 0 | 2 |
| 2019 | 2 | 0 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 2 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- LGA socket pins for improved differential signaling performance24 Feb 2026US 12,563,686 B2Intel Corporation
- Electronic component11 Feb 2020US 10,560,066 B2Murata Manufacturing Co., Ltd.
- Socket receiving an electronic component having a plurality of contact pads19 Nov 2019US 10,483,666 B2Tyco Electronics Japan G. K.
- Device, system and method for providing zone-based configuration of socket structures30 Apr 2019US 10,278,302 B2Intel Corporation
- Snap connector for socket assembly and associated techniques and configurations25 Oct 2016US 9,478,881 B2Intel Corporation
- Vertical tray storage system with internal electrical power distribution system11 Apr 2024US 2024/0116714 A1
- Socket interconnect structures and related methods4 Apr 2024US 2024/0113479 A1Intel Corporation
- Lga socket pins for improved differential signaling performance16 Feb 2023US 2023/0046581 A1Intel Corporation
- Socket4 Oct 2018US 2018/0287279 A1Tyco Electronics Japan G. K.
- Electronic component1 Mar 2018US 2018/0061670 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Dual beam connector68US 4,533,187 AAugat Inc. · 1985
- Dual-in-line socket63US 3,989,331 AAugat Inc. · 1976
- Terminal piece sealing structure54US 5,090,919 AOMRON Corporation · 1992
- Surface mount socket for dual in-line package50US 4,682,829 AAMP Incorporated · 1987
- Integrated circuit carrier assembly31US 4,417,777 AMolex Incorporated · 1983