Snap connector for socket assembly and associated techniques and configurations
AssigneeIntel Corporation
InventorsZhichao Zhang, Gaurav Chawla, Rajasekaran Swaminathan, Kemal Aygun, Li Sun
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AssigneeIntel Corporation
InventorsZhichao Zhang, Gaurav Chawla, Rajasekaran Swaminathan, Kemal Aygun, Li Sun
Estimating the term…
Embodiments of the present disclosure are directed towards a snap connector for socket assembly and associated techniques and configurations. In one embodiment, a socket assembly includes a socket body having a plurality of openings extending from a first side of the socket body to a second side of the socket body to provide an electrical pathway between the first side and the second side, the second side disposed opposite to the first side, wherein a holding portion of an individual opening of the plurality of openings adjacent to the first side of the socket body is shaped to hold a corresponding electrical contact of a die package by elastic force applied by the socket body to the electrical contact when the electrical contact is positioned within the holding portion. Other embodiments may be described and/or claimed.
A socket assembly comprising:
An integrated circuit (IC) assembly comprising:
A method of fabricating an integrated package assembly comprising:
Dependencies are inferred from the claim text.