Device, system and method for providing zone-based configuration of socket structures

A socket device, comprising:

• a socket body having a top side that is opposite of a bottom side;
• a first plurality of interconnects, each extending in the socket body, to couple to a bottom side of an electrical device;
• and
• a second plurality of pin interconnects, each extending in the socket body, to couple to the first and second plurality of pin interconnects of the top side of the socket body to a plurality of contacts on the bottom side of the electrical device, wherein at least one or more of first plurality of interconnects and the second plurality of pin interconnects of the socket body extend from the top side of socket body and at least partially toward the bottom side of socket body;
• wherein a first zone of the socket body includes the first plurality of interconnects and a second zone of the socket body includes the second plurality of pin interconnects, wherein the first zone has a first electro-mechanical characteristic and the second zone has a second electro-mechanical characteristic, and wherein, of the first zone and the second zone, only the first zone has the first electro-mechanical characteristic selected from the group consisting of:
• an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure.

A method comprising:

• coupling an integrated circuit device to a socket assembly including a socket body having a top side that is opposite of a bottom side, the coupling including:
• coupling first contacts on a bottom side of the integrated circuit device to a first plurality of interconnects each extending in a first zone of the socket body;
• and
• coupling second contacts on a bottom side of the integrated circuit device to a second plurality of interconnects each extending in a second zone of the socket body;
• and
• exchanging signals between the integrated circuit device and the socket assembly;
• wherein the first zone has a first electro-mechanical characteristic and the second zone has a second electro-mechanical characteristic, and wherein, of the first zone and the second zone, only the first zone has the first electro-mechanical characteristic selected from the group consisting of:
• an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure.

A system comprising:

• a printed circuit board;
• and
• a socket assembly including:
• a socket body;
• a first plurality of interconnects, each extending in the socket body, to couple to an integrated circuit device;
• a second plurality of pins interconnects, each extending in the socket body, to couple to the integrated circuit device;
• and
• a frame coupling the socket assembly to the printed circuit board;
• a second socket sub-assembly having a second sub-assembly body, wherein a first connector structure of a first sub-assembly body is configured to couple the first socket sub-assembly to the second socket sub-assembly to form at least part of a socket assembly body that includes a first zone and a second zone,
• wherein the first zone of the socket body includes the first plurality of interconnects and the second zone of the socket body includes the second plurality of interconnects, wherein the first zone has a first electro-mechanical characteristic and the second zone has a second electro-mechanical characteristic, and wherein, of the first zone and the second zone, only the first zone has the first electro-mechanical characteristic selected from the group consisting of:
• an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure.