Wiring substrate and manufacturing method thereof

A wiring substrate comprising:

• a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components;
• a window section formed in the substrate;
• and a connection terminal extended from and protruding within an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate, the inside surface portion being perpendicular to the front and rear surface of the substrate, a portion of the connection terminal protruding within the inside surface portion being completely surrounded by the substrate,
• wherein the window section has a predetermined height in the direction perpendicular to the surface of the substrate,
• wherein the portion of the connection terminal protrudes from the window section at a position which is substantially at a center of the predetermined height,
• wherein the window section is a continuous opening, throughout the substrate, from the front surface to the rear surface, and
• wherein the window section is formed entirely within the substrate such that all sides of the window section are surrounded by a portion of the substrate extending from the front surface to the rear surface at the predetermined height.