Wiring substrate and manufacturing method thereof
AssigneeYazaki Corporation
InventorsAkira HARAO, Mototatsu MATSUNAGA, Yasuhiro SUGIURA, Minoru KUBOTA
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Abstract
Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.
Claims7
A wiring substrate comprising:
- a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components;
- a window section formed in the substrate;
- and
- a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.
A method of manufacturing a wiring substrate which includes a substrate having a high thermal conductive layer in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components, a window section formed on the substrate, and a connection terminal which is extended from an inside surface portion of the window section and bent in a direction perpendicular to a surface of the substrate, the method comprising:
- a substrate forming process of stacking insulation layers on front and rear surfaces of a conductive metal plate which becomes the connection terminal to form the substrate;
- a metal plate exposing process of removing the insulation layers from a portion of the substrate in which the window section is to be formed, to expose the conductive metal plate;
- and
- a connection terminal forming process of processing the exposed conductive metal plate to form the window section and the connection terminal.
Dependencies are inferred from the claim text.