H05K 3/20
By affixing prefabricated conductor pattern
Official title: by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)}
H05K3/20 (By affixing prefabricated conductor pattern) appears on 2,001 US grants and 1,873 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,001
- Published applications
- 1,873
- Assignees
- 832
- Inventors
- 3,953
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 6 | 0 |
| 1982 | 3 | 0 |
| 1983 | 7 | 0 |
| 1984 | 11 | 0 |
| 1985 | 9 | 0 |
| 1986 | 9 | 0 |
| 1987 | 18 | 0 |
| 1988 | 17 | 0 |
| 1989 | 23 | 0 |
| 1990 | 38 | 0 |
| 1991 | 32 | 0 |
| 1992 | 14 | 0 |
| 1993 | 27 | 0 |
| 1994 | 30 | 0 |
| 1995 | 26 | 0 |
| 1996 | 20 | 0 |
| 1997 | 24 | 0 |
| 1998 | 38 | 0 |
| 1999 | 55 | 0 |
| 2000 | 44 | 0 |
| 2001 | 53 | 48 |
| 2002 | 71 | 101 |
| 2003 | 86 | 95 |
| 2004 | 86 | 104 |
| 2005 | 72 | 102 |
| 2006 | 78 | 109 |
| 2007 | 71 | 114 |
| 2008 | 56 | 128 |
| 2009 | 69 | 134 |
| 2010 | 84 | 124 |
| 2011 | 92 | 79 |
| 2012 | 78 | 78 |
| 2013 | 79 | 53 |
| 2014 | 49 | 55 |
| 2015 | 49 | 65 |
| 2016 | 59 | 73 |
| 2017 | 50 | 76 |
| 2018 | 55 | 49 |
| 2019 | 70 | 45 |
| 2020 | 42 | 45 |
| 2021 | 32 | 38 |
| 2022 | 42 | 40 |
| 2023 | 25 | 32 |
| 2024 | 39 | 37 |
| 2025 | 22 | 33 |
| 2026 | 10 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Method of manufacturing transient electronics15 Sep 2026US 12,739,979 B2Accenture Global Solutions Limited
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Method for manufacturing conductive tracks and transparent laminated pane8 Oct 2026US 2026/0313788 A1ams-OSRAM International GmbH
- Films, methods of making films, and devices incorporating the film17 Sep 2026US 2026/0282239 A1
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Electrically conductive tape with monolayered conductive pressure sensitive adhesive23 Jul 2026US 2026/0209571 A13M Innovative Properties Company
- Electrical connection unit16 Jul 2026US 2026/0204811 A1Yazaki Corporation
Most cited
By later US patents
- Transferred flexible integrated circuit464US 6,027,958 AKopin Corporation · 2000
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002