H05K 3/202
Using self-supporting metal foil pattern
Official title: {using self-supporting metal foil pattern}
H05K3/202 (Using self-supporting metal foil pattern) appears on 633 US grants and 521 published applications in this corpus.
Search patents in H05K- Granted patents
- 633
- Published applications
- 521
- Assignees
- 381
- Inventors
- 1,373
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 4 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 6 | 0 |
| 1988 | 11 | 0 |
| 1989 | 10 | 0 |
| 1990 | 21 | 0 |
| 1991 | 12 | 0 |
| 1992 | 3 | 0 |
| 1993 | 10 | 0 |
| 1994 | 2 | 0 |
| 1995 | 9 | 0 |
| 1996 | 12 | 0 |
| 1997 | 16 | 0 |
| 1998 | 14 | 0 |
| 1999 | 14 | 0 |
| 2000 | 17 | 0 |
| 2001 | 18 | 19 |
| 2002 | 31 | 33 |
| 2003 | 32 | 32 |
| 2004 | 32 | 37 |
| 2005 | 18 | 34 |
| 2006 | 31 | 28 |
| 2007 | 25 | 31 |
| 2008 | 15 | 29 |
| 2009 | 21 | 25 |
| 2010 | 18 | 28 |
| 2011 | 21 | 18 |
| 2012 | 21 | 21 |
| 2013 | 11 | 16 |
| 2014 | 9 | 23 |
| 2015 | 13 | 18 |
| 2016 | 16 | 22 |
| 2017 | 20 | 19 |
| 2018 | 15 | 12 |
| 2019 | 15 | 17 |
| 2020 | 17 | 15 |
| 2021 | 8 | 10 |
| 2022 | 17 | 10 |
| 2023 | 3 | 8 |
| 2024 | 9 | 9 |
| 2025 | 3 | 5 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Circuit board, an image sensor module, a lens driving device, and a camera module including the same10 Feb 2026US 12,549,838 B2LG Innotek Co., Ltd.
- Production process of base with electronic component9 Sep 2025US 12,411,190 B2Suzhou Gyz Electronic Technology Co., Ltd.
- Substrate structures and methods of manufacture9 Sep 2025US 12,414,238 B2Semiconductor Components Industries, LLC
- Substrate for contacting at least one electrical pin of a charging inlet29 Jul 2025US 12,374,845 B2TE Connectivity Solutions GmbH
- Electrical connection unit16 Jul 2026US 2026/0204811 A1Yazaki Corporation
- Circuit board, an image sensor module, a lens driving device, and a camera module including the same21 May 2026US 2026/0143217 A1LG Innotek Co., Ltd.
- Method for producing laminate3 Jul 2025US 2025/0214319 A1NHK Spring Co., Ltd.
- Method for manufacturing laminated body19 Jun 2025US 2025/0196485 A1Lps Tech Co.,Ltd
- Methods for promoting selective copper foil adhesion in a printed circuit board8 May 2025US 2025/0151205 A1Rockwell Collins, Inc.
Most cited
By later US patents
- Low-pin-count chip package and manufacturing method thereof176US 6,238,952 B1Advanced Semiconductor Engineering, Inc. · 2001
- Taillight fixture for motor vehicles with printed circuit boards with connectors and LED's167US 5,975,715 AReitter & Schefenacker GmbH & Co. KG · 1999
- Lead frame and method for manufacturing same159US 5,643,433 AShinko Electric Industries Co., Ltd. · 1997
- Direct bonding of metals to ceramics and metals132US 3,994,430 AGeneral Electric Company · 1976
- Lead frame and method for manufacturing same103US 5,909,053 AShinko Electric Industries Co., Ltd. · 1999