Method for manufacturing laminated body

Abstract

Provided is a method for manufacturing a laminated body that is capable of maintaining stable bonding between the electronic component and the circuit pattern even when the employed electronic component generates a large amount of heat, and suppressing defects caused in the insulating layer. A method for manufacturing a laminated body in which a base substrate, an insulating layer, a circuit pattern, and an electronic component are laminated in this order, the method including: a step of providing the insulating layer on a front surface side of the base substrate; a step of providing the electronic component on a front surface side of the circuit pattern; and a step of laminating the insulating layer provided on the base substrate and the circuit pattern provided with the electronic component with each other.

Dependencies are inferred from the claim text.