H05K 3/205
Using a pattern electroplated or electroformed on a metallic carrier
Official title: {using a pattern electroplated or electroformed on a metallic carrier}
H05K3/205 (Using a pattern electroplated or electroformed on a metallic carrier) appears on 572 US grants and 558 published applications in this corpus.
Search patents in H05K- Granted patents
- 572
- Published applications
- 558
- Assignees
- 215
- Inventors
- 1,061
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 6 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 8 | 0 |
| 1992 | 4 | 0 |
| 1993 | 12 | 0 |
| 1994 | 16 | 0 |
| 1995 | 8 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 14 | 0 |
| 1999 | 15 | 0 |
| 2000 | 6 | 0 |
| 2001 | 11 | 7 |
| 2002 | 15 | 16 |
| 2003 | 20 | 20 |
| 2004 | 11 | 23 |
| 2005 | 17 | 20 |
| 2006 | 15 | 35 |
| 2007 | 17 | 39 |
| 2008 | 17 | 51 |
| 2009 | 23 | 53 |
| 2010 | 32 | 53 |
| 2011 | 34 | 35 |
| 2012 | 39 | 36 |
| 2013 | 47 | 25 |
| 2014 | 22 | 8 |
| 2015 | 20 | 10 |
| 2016 | 16 | 28 |
| 2017 | 11 | 24 |
| 2018 | 14 | 17 |
| 2019 | 21 | 8 |
| 2020 | 6 | 10 |
| 2021 | 6 | 3 |
| 2022 | 6 | 14 |
| 2023 | 7 | 5 |
| 2024 | 9 | 10 |
| 2025 | 8 | 7 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board, semiconductor device, and wiring board manufacturing method30 Dec 2025US 12,513,829 B2Shinko Electric Industries Co., Ltd.
- Wiring transfer plate, wiring-equipped wiring transfer plate, wiring body intermediate material, and method for manufacturing wiring body16 Dec 2025US 12,501,554 B2Panasonic Intellectual Property Management Co., Ltd.
- Metal foil, carrier with metal foil comprising the same and printed circuit board including the same9 Dec 2025US 12,495,494 B2Ymt Co., Ltd.
- Systems and methods for manufacturing electrical components using electrochemical deposition15 Jul 2025US 12,359,334 B2Fabric8Labs, Inc.
- Production method for multilayer wiring board13 May 2025US 12,302,504 B2Mitsui Mining & Smelting Co., Ltd.
- Ultra-thin copper foil with carrier foil and method for manufacturing embedded substrate by using same29 Jan 2026US 2026/0032815 A1Lotte Energy Materials Corporation
- Transfer laminate and manufacturing method therefor27 Nov 2025US 2025/0365870 A1DIC Corporation
- Systems and methods for manufacturing electrical components using electrochemical deposition13 Nov 2025US 2025/0347023 A1Fabric8Labs, Inc.
- Low-loss flat-cable signal line for ultra-high frequency, flexible printed circuit board using the same, and flexible printed circuit board continuous-manufacturing device30 Oct 2025US 2025/0338392 A1Samwon Act Co., Ltd.
- Circuit board structure and manufacturing method thereof23 Oct 2025US 2025/0331108 A1Unimicron Technology Corp.
Most cited
By later US patents
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991
- Lead frame and method for manufacturing same159US 5,643,433 AShinko Electric Industries Co., Ltd. · 1997
- Semiconductor device and method for manufacturing substrate of the same147US 6,351,031 B1Fujitsu Limited · 2002
- Method of manufacturing a multilayer circuit board138US 5,046,238 ARogers Corporation · 1991