H05K 3/207
Using a prefabricated paste pattern, ink pattern or powder pattern
Official title: {using a prefabricated paste pattern, ink pattern or powder pattern}
H05K3/207 (Using a prefabricated paste pattern, ink pattern or powder pattern) appears on 289 US grants and 305 published applications in this corpus.
Search patents in H05K- Granted patents
- 289
- Published applications
- 305
- Assignees
- 203
- Inventors
- 763
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 7 | 0 |
| 2001 | 11 | 6 |
| 2002 | 6 | 13 |
| 2003 | 7 | 14 |
| 2004 | 13 | 12 |
| 2005 | 10 | 16 |
| 2006 | 9 | 15 |
| 2007 | 5 | 14 |
| 2008 | 11 | 20 |
| 2009 | 7 | 22 |
| 2010 | 11 | 23 |
| 2011 | 15 | 6 |
| 2012 | 9 | 10 |
| 2013 | 10 | 4 |
| 2014 | 7 | 9 |
| 2015 | 5 | 21 |
| 2016 | 7 | 11 |
| 2017 | 11 | 16 |
| 2018 | 10 | 6 |
| 2019 | 19 | 13 |
| 2020 | 10 | 9 |
| 2021 | 10 | 11 |
| 2022 | 12 | 5 |
| 2023 | 7 | 12 |
| 2024 | 8 | 6 |
| 2025 | 7 | 8 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Conductive patterns and methods thereof16 Jun 2026US 12,655,326 B23M Innovative Properties Company
- Method for producing electrical circuitry on filled organic polymers14 Apr 2026US 12,604,413 B2
- Method for forming wiring on semiconductor device16 Dec 2025US 12,500,121 B2CONNECTEC JAPAN Corporation
- Application of electrical conductors to an electrically insulating substrate14 Oct 2025US 12,446,160 B2Landa Labs (2012) Ltd.
- Patterned conductive article15 Jul 2025US 12,363,825 B23M Innovative Properties Company
- Films, methods of making films, and devices incorporating the film17 Sep 2026US 2026/0282239 A1
- Method and device for printing a substance on a target surface of a target19 Mar 2026US 2026/0077581 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Methods and mechanisms for maintaining an electro-active polymer in a pre-stretch state and uses thereof12 Feb 2026US 2026/0047013 A1ElastiMed Ltd.
- Transfer laminate and manufacturing method therefor27 Nov 2025US 2025/0365870 A1DIC Corporation
- Permeable bioelectronic systems and methods for making the same9 Oct 2025US 2025/0314651 A1The Hong Kong Polytechnic University
Most cited
By later US patents
- Stretchable and foldable electronic devices220US 8,552,299 B2The Board of Trustees of the University of Illinois · 2013
- Stretchable and foldable electronic devices116US 8,905,772 B2Northwestern University · 2014
- Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays107US 6,274,412 B1Parelec, Inc. · 2001
- Area bonding conductive adhesive preforms89US 5,667,884 A1997
- Process for preparing printed circuits82US 4,722,765 APreh Elektrofeinmechanische Werke Jakob Preh Nachf. GmbH & Co. · 1988