Process for preparing printed circuits

A reverse laminated process for producing printed circuits, said circuits having elements selected from electrical resistors, conductor strips and connectors integrated therein, characterized by the following process steps:

• polishing a heat sensitive, copper alloy intermediate carrier to a high gloss on a given coating side;
• preparing a metal oxide separating layer directly on said coating side of said intermediate carrier, said separating layer being removable by etching;
• printing said separating layer of said coated intermediate carrier with said elements in a desired mirror-inverted lay-out and then drying same;
• subjecting said coated, printed and dried intermediate carrier to heat treatment at an elevated temperature to cure said lay-out;
• laminating said heat treated carrier onto a substrate;
• removing only said intermediate carrier from said oxide separating layer, said oxide separating layer remaining affixed to said substrate and said intermediate carrier removed in a condition suitable for reuse in the same process;
• and
• etching off said oxide separating layer from said substrate after said intermediate carrier has been removed to form a laminated printed circuit.