Electrically conductive tape with monolayered conductive pressure sensitive adhesive

An electrically conductive bonding tape comprising an electrically conductive first film bonded to an electrically conductive first adhesive layer, each of the first film and the first adhesive layer electrically conductive at least along a thickness direction of the bonding tape, the first adhesive layer comprising a plurality of electrically conductive particles dispersed substantially as a single layer in a substantially electrically insulative adhesive material, the plurality of electrically conductive particles in the first adhesive layer having an average particle size Pav and a standard of deviation Psd, Psd/Pav less than about 0.2,

• the first adhesive layer having an average thickness of no more than about 15% greater than the average particle size of the particles in the adhesive layer,
• wherein, an average surface roughness of each of opposing major first and second surfaces of the first film is less than about 10 microns,
• wherein, when the electrically conductive first adhesive layer bonds the electrically conductive bonding tape to a major surface of a stainless steel plate, the bonding tape forms a resistive contact with the stainless steel plate with a resistance value that changes by less than about 200% after repeatedly cycling the bonding tape and the stainless steel plate both between a lower temperature of no more than about zero degrees centigrade and a higher temperature of no less than about 40 degrees centigrade for at least 50 hours.