H05K 3/12
Using thick film techniques
Official title: using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}
H05K3/12 (Using thick film techniques) appears on 3,486 US grants and 4,070 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,486
- Published applications
- 4,070
- Assignees
- 1,458
- Inventors
- 7,631
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 5 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 8 | 0 |
| 1981 | 14 | 0 |
| 1982 | 7 | 0 |
| 1983 | 11 | 0 |
| 1984 | 10 | 0 |
| 1985 | 22 | 0 |
| 1986 | 13 | 0 |
| 1987 | 23 | 0 |
| 1988 | 18 | 0 |
| 1989 | 23 | 0 |
| 1990 | 29 | 0 |
| 1991 | 23 | 0 |
| 1992 | 23 | 0 |
| 1993 | 28 | 0 |
| 1994 | 37 | 0 |
| 1995 | 41 | 0 |
| 1996 | 38 | 0 |
| 1997 | 30 | 0 |
| 1998 | 68 | 0 |
| 1999 | 63 | 0 |
| 2000 | 73 | 0 |
| 2001 | 66 | 27 |
| 2002 | 68 | 82 |
| 2003 | 76 | 109 |
| 2004 | 87 | 165 |
| 2005 | 62 | 163 |
| 2006 | 86 | 191 |
| 2007 | 76 | 192 |
| 2008 | 81 | 180 |
| 2009 | 96 | 217 |
| 2010 | 132 | 171 |
| 2011 | 121 | 144 |
| 2012 | 129 | 148 |
| 2013 | 87 | 158 |
| 2014 | 125 | 218 |
| 2015 | 141 | 221 |
| 2016 | 159 | 174 |
| 2017 | 140 | 190 |
| 2018 | 135 | 172 |
| 2019 | 176 | 189 |
| 2020 | 135 | 191 |
| 2021 | 169 | 180 |
| 2022 | 129 | 151 |
| 2023 | 103 | 131 |
| 2024 | 128 | 128 |
| 2025 | 100 | 100 |
| 2026 | 60 | 78 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 3/1216By screen printing or stencil printing1,390
- H05K 3/1241By ink-jet printing or drawing by dispensing985
- H05K 3/1283After-treatment of the printed patterns461
- H05K 3/1275By other printing techniques302
- H05K 3/1258By using a substrate provided with a shape pattern293
- H05K 3/1208Pretreatment of the circuit board122
- H05K 3/1266By electrographic or magnetographic printing68
Recent patents
- Technologies for reducing the impact of radiofrequency interference on a circuit board6 Oct 2026US 12,757,317 B2Intel Corporation
- Method and system for detection and analysis of chemical compounds in a sample subjected to a chromatographic separation on a layered separating medium29 Sep 2026US 12,748,088 B2Technion Research & Development Foundation Limited
- Method of manufacturing transient electronics15 Sep 2026US 12,739,979 B2Accenture Global Solutions Limited
- Transparent article with electrically-conductive pattern1 Sep 2026US 12,727,092 B2Eastman Kodak Company
- Silver nanowire thin-film patterning method25 Aug 2026US 12,721,113 B2Seoul National University R&Db Foundation
- Transparent article with electrically-conductive pattern8 Oct 2026US 2026/0313810 A1Eastman Kodak Company
- Conductive film forming apparatus and conductive film forming method1 Oct 2026US 2026/0304637 A1Shibaura Mechatronics Corporation
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- A Curable Inkjet Composition for the Manufacturing of Printed Circuit Boards24 Sep 2026US 2026/0286155 A1Agfa-Gevaert
- Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow24 Sep 2026US 2026/0293000 A1Jabil Inc.
Most cited
By later US patents
- Multi-color electrophoretic displays and materials for making the same695US 6,017,584 AE Ink Corporation · 2000
- Electronically addressable microencapsulated ink and display thereof597US 6,120,588 AE Ink Corporation · 2000
- Transducers and indicators having printed displays561US 6,118,426 AE Ink Corporation · 2000
- Electrophoretic displays using nanoparticles501US 6,323,989 B1E Ink Corporation · 2001
- Electro-osmotic displays and materials for making the same476US 6,120,839 AE Ink Corporation · 2000