H05K 3/1216
By screen printing or stencil printing
Official title: {by screen printing or stencil printing}
H05K3/1216 (By screen printing or stencil printing) appears on 1,390 US grants and 1,181 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,390
- Published applications
- 1,181
- Assignees
- 610
- Inventors
- 2,715
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 10 | 0 |
| 1982 | 4 | 0 |
| 1983 | 7 | 0 |
| 1984 | 2 | 0 |
| 1985 | 9 | 0 |
| 1986 | 10 | 0 |
| 1987 | 14 | 0 |
| 1988 | 12 | 0 |
| 1989 | 12 | 0 |
| 1990 | 17 | 0 |
| 1991 | 13 | 0 |
| 1992 | 12 | 0 |
| 1993 | 20 | 0 |
| 1994 | 25 | 0 |
| 1995 | 29 | 0 |
| 1996 | 31 | 0 |
| 1997 | 22 | 0 |
| 1998 | 57 | 0 |
| 1999 | 52 | 0 |
| 2000 | 55 | 0 |
| 2001 | 54 | 23 |
| 2002 | 52 | 62 |
| 2003 | 60 | 49 |
| 2004 | 55 | 62 |
| 2005 | 33 | 39 |
| 2006 | 36 | 41 |
| 2007 | 24 | 38 |
| 2008 | 23 | 54 |
| 2009 | 19 | 53 |
| 2010 | 34 | 41 |
| 2011 | 23 | 43 |
| 2012 | 28 | 42 |
| 2013 | 28 | 50 |
| 2014 | 42 | 54 |
| 2015 | 46 | 55 |
| 2016 | 40 | 43 |
| 2017 | 35 | 50 |
| 2018 | 37 | 47 |
| 2019 | 48 | 52 |
| 2020 | 37 | 61 |
| 2021 | 52 | 47 |
| 2022 | 29 | 44 |
| 2023 | 37 | 44 |
| 2024 | 33 | 36 |
| 2025 | 31 | 24 |
| 2026 | 23 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Technologies for reducing the impact of radiofrequency interference on a circuit board6 Oct 2026US 12,757,317 B2Intel Corporation
- Liquid metal circuits and methods of making the same18 Aug 2026US 12,713,523 B2Carnegie Mellon University
- Self correcting oven technology11 Aug 2026US 12,703,036 B2Jabil Inc.
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Surface modification of solder paste stencils4 Aug 2026US 12,697,808 B2Newtech LLC
- Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow24 Sep 2026US 2026/0293000 A1Jabil Inc.
- Tensioned printing screen frame, assembly and method17 Sep 2026US 2026/0282238 A1Tannlin Technology Limited
- Printing operation with improved stencil separation27 Aug 2026US 2026/0249633 A1Asmpt Smt Singapore Pte. Ltd.
- Apparatus and method and recording medium for recording command for determining type of defect30 Jul 2026US 2026/0219973 A1Koh Young Technology Inc.
- Method for manufacturing at least one electrode of an analyte sensor16 Jul 2026US 2026/0202373 A1Roche Diabetes Care, Inc.
Most cited
By later US patents
- Method and apparatus for dispensing material in a printer206US 6,453,810 B1Speedline Technologies, Inc. · 2002
- Surface mount solder assembly of leadless integrated circuit packages to substrates197US 5,346,118 AAT&T Bell Laboratories · 1994
- Conductive elastomeric contacts and connectors186US 3,971,610 ATechnical Wire Products, Inc. · 1976
- Method of forming electrically conductive polymer interconnects on electrical substrates159US 5,611,140 AEpoxy Technology, Inc. · 1997
- Method of bumping substrates by contained paste deposition146US 5,539,153 AHewlett-Packard Company · 1996