H05K 3/1233
Methods or means for supplying the conductive material and for forcing it
Official title: {Methods or means for supplying the conductive material and for forcing it through the screen or stencil}
H05K3/1233 (Methods or means for supplying the conductive material and for forcing it) appears on 452 US grants and 359 published applications in this corpus.
Search patents in H05K- Granted patents
- 452
- Published applications
- 359
- Assignees
- 191
- Inventors
- 799
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 8 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 5 | 0 |
| 1996 | 14 | 0 |
| 1997 | 9 | 0 |
| 1998 | 19 | 0 |
| 1999 | 16 | 0 |
| 2000 | 18 | 0 |
| 2001 | 20 | 13 |
| 2002 | 23 | 28 |
| 2003 | 24 | 26 |
| 2004 | 30 | 21 |
| 2005 | 14 | 9 |
| 2006 | 11 | 8 |
| 2007 | 4 | 9 |
| 2008 | 4 | 10 |
| 2009 | 4 | 11 |
| 2010 | 9 | 8 |
| 2011 | 2 | 11 |
| 2012 | 8 | 10 |
| 2013 | 5 | 19 |
| 2014 | 11 | 22 |
| 2015 | 21 | 21 |
| 2016 | 21 | 14 |
| 2017 | 14 | 13 |
| 2018 | 13 | 12 |
| 2019 | 8 | 11 |
| 2020 | 9 | 21 |
| 2021 | 19 | 13 |
| 2022 | 11 | 12 |
| 2023 | 13 | 12 |
| 2024 | 5 | 11 |
| 2025 | 9 | 6 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Alignment of singulated substrates5 May 2026US 12,617,198 B2Asmpt Smt Singapore Pte. Ltd.
- System and method for measuring static volume in a material container28 Apr 2026US 12,613,122 B2Illinois Tool Works Inc.
- Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies3 Mar 2026US 12,564,908 B2Raytheon Company
- Solder paste dispensing feedback system and circuit board printer using the same10 Feb 2026US 12,544,847 B2Illinois Tool Works Inc.
- Printing operation with improved stencil separation27 Aug 2026US 2026/0249633 A1Asmpt Smt Singapore Pte. Ltd.
- Printing process assistance system7 May 2026US 2026/0124831 A1Yamaha Hatsudoki Kabushiki Kaisha
- Method for forming stencil mask7 May 2026US 2026/0129765 A1STATS ChipPAC Pte. Ltd.
- Pcb stencil printing with shrinkage compensation23 Apr 2026US 2026/0113851 A1International Business Machines Corporation
- Alignment of singulated workpieces5 Mar 2026US 2026/0062232 A1Asmpt Smt Singapore Pte. Ltd.
Most cited
By later US patents
- Method and apparatus for dispensing material in a printer206US 6,453,810 B1Speedline Technologies, Inc. · 2002
- Conductive elastomeric contacts and connectors186US 3,971,610 ATechnical Wire Products, Inc. · 1976
- Method and apparatus for dispensing viscous materials145US 4,622,239 AAT&T Technologies, Inc. · 1986
- Apparatus for dispensing material in a printer120US 5,947,022 ASpeedline Technologies, Inc. · 1999
- Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template120US 6,646,662 B1Seiko Epson Corporation · 2003