Back to results
US 12,564,908 B2Granted
Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies
AssigneeRaytheon Company
InventorsSergio V. Martinez, Jeffrey R. Ogorzalek, Patrick J. Lott
Life of this patent
Estimating the term…
Abstract
A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.
Claims5
A substrate of an electronic assembly comprising:
- a solder paste comprising a metal in a deposition pattern within a pad area of the substrate, the deposition pattern comprising an array of discrete domains of the solder paste comprising the metal that extends across the pad area of the substrate with regular spacings of about 0.076 to about 0.203 millimeters (mm) between the discrete domains, the deposition pattern comprising the array of discrete domains has a tangency with respect to an edge of the pad area of about 0.025 mm to about 0.127 mm;
- wherein the pad area comprises palladium or a palladium alloy.
Dependencies are inferred from the claim text.