H05K 3/1275
By other printing techniques
Official title: {by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing}
H05K3/1275 (By other printing techniques) appears on 302 US grants and 393 published applications in this corpus.
Search patents in H05K- Granted patents
- 302
- Published applications
- 393
- Assignees
- 212
- Inventors
- 812
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 4 | 8 |
| 2003 | 3 | 12 |
| 2004 | 9 | 11 |
| 2005 | 4 | 8 |
| 2006 | 7 | 11 |
| 2007 | 1 | 17 |
| 2008 | 5 | 11 |
| 2009 | 6 | 12 |
| 2010 | 5 | 8 |
| 2011 | 8 | 6 |
| 2012 | 8 | 14 |
| 2013 | 1 | 14 |
| 2014 | 10 | 23 |
| 2015 | 17 | 32 |
| 2016 | 16 | 18 |
| 2017 | 18 | 41 |
| 2018 | 20 | 21 |
| 2019 | 34 | 24 |
| 2020 | 23 | 27 |
| 2021 | 15 | 13 |
| 2022 | 16 | 13 |
| 2023 | 12 | 15 |
| 2024 | 18 | 16 |
| 2025 | 11 | 8 |
| 2026 | 3 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Method of forming an electronic device on a flexible substrate24 Mar 2026US 12,585,183 B2Fundació Institut Catalá De NanociéNcia I Nanotecnologia
- Method for manufacturing circuit wiring by three-dimensional additive manufacturing10 Feb 2026US 12,550,268 B2Fuji Corporation
- Method for forming wiring on semiconductor device16 Dec 2025US 12,500,121 B2CONNECTEC JAPAN Corporation
- Enhancing efficiency of resist patterning9 Dec 2025US 12,493,245 B2Orbotech Ltd.
- Conductive ink composition and wiring pattern27 Aug 2026US 2026/0250537 A1Dupont Electronics, Inc.
- Method for forming conductive structure27 Aug 2026US 2026/0255495 A1Dupont Electronics, Inc.
- Method for producing opening detection sheet, opening detection sheet, and packaging material4 Jun 2026US 2026/0152334 A1Uacj Corporation
- Methods for laser induced printing of electrodes with increased lifespan4 Jun 2026US 2026/0152859 A1Reophotonics, Ltd.
- Systems and Methods for Liquid Metal Printing7 May 2026US 2026/0129767 A1The Regents of the University of California
Most cited
By later US patents
- Electrical circuit component formed of a conductive liquid printed directly onto a substrate117US 5,763,058 AParamount Packaging Corporation · 1998
- Method for preventing distortions in a flexibly transferred feature pattern92US 6,655,286 B2Lucent Technologies Inc. · 2003
- Micro-contact printing stamp89US 5,937,758 AMotorola, Inc. · 1999
- Apparatus and method for creating flexible circuits80US 6,697,694 B2Electronic Materials, L.L.C. · 2004
- Method of utilizing a contact printing stamp76US 7,374,968 B2Hewlett-Packard Development Company, L. P. · 2008