Method of utilizing a contact printing stamp
AssigneeHewlett-Packard Development Company, L.P.
InventorsPavel Kornilovich, Peter Mardilovich, Kevin F Peters
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Abstract
A method of using a contact printing stamp, including forming a transfer material on a plurality of stamping surfaces. The plurality of stamping surfaces are disposed on a plurality of stamp protrusions adapted from the forming of a stamp material in a plurality of recessed regions formed in an exposed end-region of a multilayer thin film structure.
Claims48
A method of using a contact printing stamp, comprising:
- forming a transfer material on a plurality of stamping surfaces, said plurality of stamping surfaces disposed on a plurality of stamp protrusions adapted from the forming of a stamp material in a plurality of recessed regions, wherein said plurality of recessed regions are formed in an exposed end-region of a multilayer thin film structure.
A method of using an exposed end-region of a multilayer thin film structure as a contact printing stamp, comprising:
- forming a transfer material on a plurality of stamping surfaces, said plurality of stamping surfaces disposed on a plurality of stamp protrusions, wherein at least one stamp protrusion has either a printing feature having at least a portion forming a curved shape in at least one lateral dimension, or two printing features meeting at an angle less than 180 degrees in at least one lateral dimension, or both, wherein said plurality of stamp protrusions are formed in the exposed end-region.
A method of patterning a surface utilizing a contact printing stamp, comprising:
- forming a transfer material on a stamping surface, said stamping surface having at least two indentations formed therein, said stamping surface having at least one lateral dimension less than about 80 nanometers and contiguous with said at least two indentations, said at least two indentations each having at least one lateral dimension less than about 80 nanometers;
- positioning said stamping surface over a surface;
- essentially contacting said surface with said stamping surface;
- and
- removing said stamping surface from said surface, whereby at least a portion of said transfer material remains on said surface.
A method of patterning a surface, comprising:
- forming a transfer material on a plurality of stamping surfaces, said plurality of stamping surfaces disposed on a plurality of stamp protrusions created by forming a stamp material in a plurality of recessed regions, wherein said plurality of recessed regions are formed in an exposed end-region of a multilayer thin film structure;
- and
- transferring at least a portion of said transfer material onto a receiving surface to form a patterned material on said receiving surface.
Dependencies are inferred from the claim text.