Method for preventing distortions in a flexibly transferred feature pattern
AssigneeLucent Technologies Inc.
InventorJohn A. Rogers
Life of this patent
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Abstract
A method for transferring an inked feature pattern from a stamp to a substrate is disclosed wherein the stamp and/or substrate is flexed into a cylindrical or approximately cylindrical surface before being contacted with each other. The stamp and substrate are contacted and at least one line of contact is advanced across the surface of the stamp in order to transfer the feature pattern from the stamp to the substrate.
Claims12
A method for use in transferring a feature pattern from a stamp to a substrate, said method comprising:
- flexing at least one of the substrate and the stamp;
- contacting at least one line of contact between said substrate and said stamp;
- and
- progressively advancing the at least one line of contact between said stamp and said substrate across at least one inked feature on the feature pattern of said stamp in a way such that an area of contact between said stamp and said substrate increases as said at least one line of contact advances,
- said at least one inked feature being of a size less than 100 μm in at least one lateral dimension.
A method for use in transferring a feature pattern from a stamp to a substrate in the manufacture of an electronic system, said method comprising:
- flexing at least one of the substrate and the stamp;
- contacting at least one line of contact between said substrate and said stamp;
- and
- progressively advancing the at least one line of contact between said stamp and said substrate across at least one surface of the stamp in a way such that an area of contact between said stamp and said substrate increases as said at least one line of contact advances.
Dependencies are inferred from the claim text.