H05K 3/1208
Pretreatment of the circuit board
Official title: {Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38)}
H05K3/1208 (Pretreatment of the circuit board) appears on 122 US grants and 207 published applications in this corpus.
Search patents in H05K- Granted patents
- 122
- Published applications
- 207
- Assignees
- 130
- Inventors
- 468
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 4 |
| 2004 | 2 | 4 |
| 2005 | 3 | 12 |
| 2006 | 2 | 11 |
| 2007 | 3 | 10 |
| 2008 | 1 | 6 |
| 2009 | 3 | 10 |
| 2010 | 8 | 14 |
| 2011 | 4 | 7 |
| 2012 | 11 | 8 |
| 2013 | 6 | 12 |
| 2014 | 5 | 10 |
| 2015 | 6 | 15 |
| 2016 | 6 | 13 |
| 2017 | 10 | 8 |
| 2018 | 6 | 14 |
| 2019 | 5 | 12 |
| 2020 | 8 | 7 |
| 2021 | 5 | 6 |
| 2022 | 7 | 5 |
| 2023 | 8 | 5 |
| 2024 | 7 | 9 |
| 2025 | 1 | 1 |
| 2026 | 4 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing transient electronics15 Sep 2026US 12,739,979 B2Accenture Global Solutions Limited
- Liquid metal circuits and methods of making the same18 Aug 2026US 12,713,523 B2Carnegie Mellon University
- Component mounting board18 Aug 2026US 12,713,529 B2Mektec Corporation
- Method for producing wiring board, and wiring board16 Jun 2026US 12,660,090 B2
- Manufacturing method of electronic device12 Aug 2025US 12,389,549 B2FUJIFILM Corporation
- Methods for laser induced printing of electrodes with increased lifespan4 Jun 2026US 2026/0152859 A1Reophotonics, Ltd.
- Method of forming metal pattern, substrate including the metal pattern, and electronic device including the metal pattern30 Apr 2026US 2026/0122791 A1Samsung Display Co., Ltd.
- Circuit board and manufacturing method thereof26 Feb 2026US 2026/0059646 A1Avary Holding (Shenzhen) Co., Limited.
- Conductive articles and methods for additive manufacturing thereof22 May 2025US 2025/0163278 A1PPG Industries Ohio, Inc.
- Printed product, preparation method therefor, and use thereof24 Oct 2024US 2024/0357742 A1Heraeus Electronics GmbH & Co. KG
Most cited
By later US patents
- Method of forming a masking pattern on a surface73US 6,849,308 B12005
- Method including treatment of ink on a plate to cause hardening at other than the ink outer surface before printing48US 5,127,330 ADai Nippon Insatsu Kabushiki Kaisha · 1992
- Method for forming conductive film pattern, and electro-optical device and electronic apparatus48US 6,734,029 B2Seiko Epson Corporation · 2004
- Method of forming film pattern, device for forming film pattern, conductive film wiring, electro-optical device, electronic device, and non-contact card medium47US 6,715,871 B2Seiko Epson Corporation · 2004
- Layered manufacturing of free-form multi-material micro-components28US 9,545,669 B2Digital Metal AB · 2017