Manufacturing method of electronic device
AssigneeFUJIFILM Corporation
InventorNorihide Shimohara
Life of this patent
Estimating the term…
Abstract
Provided is a manufacturing method of an electronic device, the method including: a step of preparing an electronic substrate including a wiring board, an electronic component disposed on the wiring board, and a ground electrode having an organic acid on a surface thereof; and a step of applying an ink for forming a conductive layer onto at least a part of the ground electrode having the organic acid on the surface thereof, to form a conductive layer that is a cured film of the ink for forming a conductive layer, in which the organic acid includes at least one compound selected from the group consisting of a monocarboxylic acid having a molecular weight of less than 350 and a dicarboxylic acid having a molecular weight of less than 350.
Claims8
A manufacturing method of an electronic device, the method comprising:
- preparing an electronic substrate including a wiring board, an electronic component disposed on the wiring board, and a ground electrode having an organic acid on a surface thereof;
- and
- applying an ink for forming a conductive layer onto at least a part of the ground electrode having the organic acid on the surface thereof, to form a conductive layer that is a cured film of the ink for forming a conductive layer,
- wherein the organic acid includes at least one compound selected from the group consisting of a monocarboxylic acid having a molecular weight of less than 350 and a dicarboxylic acid having a molecular weight of less than 350.
Dependencies are inferred from the claim text.