H05K 3/1258
By using a substrate provided with a shape pattern
Official title: {by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern}
H05K3/1258 (By using a substrate provided with a shape pattern) appears on 293 US grants and 382 published applications in this corpus.
Search patents in H05K- Granted patents
- 293
- Published applications
- 382
- Assignees
- 199
- Inventors
- 799
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 7 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 0 | 0 |
| 1998 | 4 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 2 |
| 2003 | 2 | 8 |
| 2004 | 4 | 6 |
| 2005 | 3 | 17 |
| 2006 | 7 | 27 |
| 2007 | 9 | 27 |
| 2008 | 12 | 23 |
| 2009 | 8 | 20 |
| 2010 | 15 | 13 |
| 2011 | 11 | 14 |
| 2012 | 16 | 17 |
| 2013 | 8 | 8 |
| 2014 | 9 | 46 |
| 2015 | 27 | 35 |
| 2016 | 26 | 11 |
| 2017 | 18 | 11 |
| 2018 | 4 | 6 |
| 2019 | 11 | 12 |
| 2020 | 12 | 12 |
| 2021 | 11 | 17 |
| 2022 | 7 | 12 |
| 2023 | 9 | 14 |
| 2024 | 9 | 13 |
| 2025 | 8 | 5 |
| 2026 | 9 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Liquid metal circuits and methods of making the same18 Aug 2026US 12,713,523 B2Carnegie Mellon University
- Electrical component and method of forming same4 Aug 2026US 12,701,657 B2Medtronic, Inc.
- Circuit-forming method and circuit-forming apparatus28 Jul 2026US 12,696,397 B2Fuji Corporation
- Flexible printed circuit board and method of manufacturing flexible printed circuit board26 May 2026US 12,641,723 B2Sumitomo Electric Industries, Ltd.
- Donor plate, deposition device and deposition method19 May 2026US 12,635,079 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Wiring substrate, light-emitting device, and manufacturing methods thereof27 Aug 2026US 2026/0255748 A1Nichia Corporation
- Manufacturing method for a circuit board and circuit board2 Apr 2026US 2026/0096019 A1JCET Management Co., Ltd.
- Printed circuit board and method of manufacturing the same26 Mar 2026US 2026/0089849 A1Samsung Electro-Mechanics Co., Ltd.
- Flexible microcavities, multi-function flexible hybrid electronics integrating the same, and screen-printing processes for fabricating the same26 Feb 2026US 2026/0054476 A1University of Florida Research Foundation, Inc.
- Fan-out wafer level packaging unit15 Jan 2026US 2026/0018505 A1Walton Advanced Engineering Inc.
Most cited
By later US patents
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Semiconductor package including top-surface terminals for mounting another semiconductor package212US 7,671,457 B1Amkor Technology, Inc. · 2010
- Integrated circuit substrate having laser-embedded conductive patterns and method therefor204US 6,930,256 B1Amkor Technology, Inc. · 2005
- Method of making subsurface electronic circuits121US 5,531,020 APoly-Flex Circuits, Inc. · 1996
- Nanosized particles deposited on shaped surface geometries117US 9,609,755 B2Hewlett-Packard Development Company, L. P. · 2017