Wiring substrate, light-emitting device, and manufacturing methods thereof

A method of manufacturing a wiring substrate, the method comprising:

• providing a base body having an insulating property and including a first surface and a second surface on a side opposite the first surface, the base body comprising a resist portion covering at least one of the first surface and the second surface of the base body and including a hole portion exposing part of the first surface and the second surface of the base body from the resist portion;
• filling the hole portion of the resist portion with a paste member containing metal particles;
• and
• firing the paste member at a temperature of 150°C or higher and lower than a melting point of the metal particles;
• wherein:
• in the step of preparing the base body, the hole portion is formed so as to have an inner bottom surface having a larger width than an opening of the hole portion;
• and
• in the step of firing the paste member, the metal particles are sintered to form a wiring line in a shape following the inner bottom surface and an inner lateral surface of the hole portion.