H05K 3/1283
After-treatment of the printed patterns
Official title: {After-treatment of the printed patterns, e.g. sintering or curing methods}
H05K3/1283 (After-treatment of the printed patterns) appears on 461 US grants and 687 published applications in this corpus.
Search patents in H05K- Granted patents
- 461
- Published applications
- 687
- Assignees
- 355
- Inventors
- 1,460
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 6 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 0 |
| 2003 | 2 | 0 |
| 2004 | 1 | 3 |
| 2005 | 2 | 8 |
| 2006 | 1 | 7 |
| 2007 | 2 | 13 |
| 2008 | 2 | 16 |
| 2009 | 1 | 27 |
| 2010 | 13 | 21 |
| 2011 | 9 | 11 |
| 2012 | 11 | 30 |
| 2013 | 10 | 30 |
| 2014 | 19 | 40 |
| 2015 | 28 | 62 |
| 2016 | 29 | 40 |
| 2017 | 29 | 30 |
| 2018 | 27 | 58 |
| 2019 | 44 | 45 |
| 2020 | 25 | 45 |
| 2021 | 36 | 49 |
| 2022 | 29 | 34 |
| 2023 | 29 | 34 |
| 2024 | 36 | 34 |
| 2025 | 21 | 27 |
| 2026 | 11 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Camera module packaging structure and electronic device having the same18 Aug 2026US 12,713,521 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Electrical component and method of forming same4 Aug 2026US 12,701,657 B2Medtronic, Inc.
- Sintering composition21 Jul 2026US 12,686,052 B2Alpha Assembly Solutions Inc.
- Method for manufacturing substrate with built-in components, and substrate with built-in components26 May 2026US 12,641,728 B2Resonac Corporation
- Method for forming conductive structure27 Aug 2026US 2026/0255495 A1Dupont Electronics, Inc.
- Method for manufacturing conductive film and conductive film20 Aug 2026US 2026/0241712 A1Ricoh Company, Ltd.
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Method for fabricating curved conformal multilayer circuit by electric-field-driven jet deposition micro-nano 3-dimensional printing based on charge control and system therefor20 Aug 2026US 2026/0247541 A1Qingdao 5D Intelligent Additive Manufacturing Technology Co., Ltd.
- Method of manufacturing metal layer having increased oxidation resistance and method of manufacturing semiconductor package20 Aug 2026US 2026/0247542 A1Research & Business Foundation Sungkyunkwan University
Most cited
By later US patents
- Direct write with microelectronic circuit fabrication159US 5,132,248 AThe United States of America as represented by the United States Department of Energy · 1992
- Method of forming a masking pattern on a surface73US 6,849,308 B12005
- Method for manufacturing conductors and semiconductors65US 9,011,762 B2Valtion Teknillinen Tutkimuskeskus · 2015
- Method for making a ceramic multilayer structure having internal copper conductors56US 4,766,027 AE. I. Du Pont de Nemours and Company · 1988
- Thick film copper conductor patterning by laser51US 4,931,323 ATexas Instruments Incorporated · 1990