H05K 2203/15
Position of the pcb during processing
Official title: Position of the PCB during processing
H05K2203/15 (Position of the pcb during processing) appears on 2,285 US grants and 2,230 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,285
- Published applications
- 2,230
- Assignees
- 1,033
- Inventors
- 5,011
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 10 | 0 |
| 1978 | 10 | 0 |
| 1979 | 5 | 0 |
| 1980 | 10 | 0 |
| 1981 | 9 | 0 |
| 1982 | 10 | 0 |
| 1983 | 21 | 0 |
| 1984 | 14 | 0 |
| 1985 | 24 | 0 |
| 1986 | 22 | 0 |
| 1987 | 22 | 0 |
| 1988 | 20 | 0 |
| 1989 | 33 | 0 |
| 1990 | 42 | 0 |
| 1991 | 48 | 0 |
| 1992 | 40 | 0 |
| 1993 | 54 | 0 |
| 1994 | 35 | 0 |
| 1995 | 35 | 0 |
| 1996 | 30 | 0 |
| 1997 | 31 | 0 |
| 1998 | 38 | 0 |
| 1999 | 50 | 0 |
| 2000 | 42 | 0 |
| 2001 | 56 | 41 |
| 2002 | 92 | 60 |
| 2003 | 50 | 83 |
| 2004 | 68 | 123 |
| 2005 | 62 | 115 |
| 2006 | 59 | 163 |
| 2007 | 71 | 148 |
| 2008 | 91 | 149 |
| 2009 | 89 | 150 |
| 2010 | 81 | 118 |
| 2011 | 93 | 120 |
| 2012 | 90 | 91 |
| 2013 | 80 | 83 |
| 2014 | 74 | 83 |
| 2015 | 66 | 97 |
| 2016 | 77 | 64 |
| 2017 | 49 | 49 |
| 2018 | 44 | 49 |
| 2019 | 61 | 50 |
| 2020 | 42 | 57 |
| 2021 | 46 | 65 |
| 2022 | 44 | 48 |
| 2023 | 38 | 44 |
| 2024 | 42 | 42 |
| 2025 | 38 | 35 |
| 2026 | 17 | 103 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/1572Processing both sides of a pcb by the same processIndexing code936
- H05K 2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier alongIndexing code651
- H05K 2203/1509Horizontally held pcbIndexing code241
- H05K 2203/1536Temporarily stacked pcbsIndexing code240
- H05K 2203/1581Treating the backside of the pcbIndexing code163
- H05K 2203/1518Vertically held pcbIndexing code101
- H05K 2203/159Using gravitational forceIndexing code63
- H05K 2203/1563Reversing the pcbIndexing code56
Recent patents
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- Manufacturing system11 Aug 2026US 12,706,428 B2TE Connectivity Solutions GmbH
- Press-in machine for pressing components into a substrate, in particular into a printed circuit board or carrier plate, with substrate positioning11 Aug 2026US 12,707,617 B2ERSA GmbH
- Semiconductor package film and manufacturing method thereof11 Aug 2026US 12,707,990 B2Samsung Display Co., Ltd.
- Printing system and method for controlling printing system16 Jun 2026US 12,654,435 B2Illinois Tool Works Inc.
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Solder joint cooling system6 Aug 2026US 2026/0231319 A1Delta Electronics (Thailand) Public Co., Ltd.
- Pcb via design for power electronic applications and method for manufacturing30 Jul 2026US 2026/0223282 A1Mitsubishi Electric Corporation
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
Most cited
By later US patents
- Fold flex circuit for LNOP540US 10,327,337 B2Masimo Corporation · 2019
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems424US 5,663,901 ASanDisk Corporation · 1997
- Method and apparatus for feeding and coating articles in a controlled atmosphere353US 4,812,217 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Lead connections means for stacked tab packaged IC chips312US 5,138,438 AAkita Electronics Co., Ltd. · 1992