H05K 2203/1527
Obliquely held pcb
Official title: Obliquely held PCB
H05K2203/1527 (Obliquely held pcb) appears on 17 US grants and 21 published applications in this corpus.
Search patents in H05K- Granted patents
- 17
- Published applications
- 21
- Assignees
- 22
- Inventors
- 48
- Latest grant
- 21 Feb 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 3 |
| 2008 | 1 | 3 |
| 2009 | 3 | 3 |
| 2010 | 0 | 2 |
| 2011 | 3 | 2 |
| 2012 | 2 | 1 |
| 2013 | 1 | 2 |
| 2014 | 1 | 0 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Wiring substrate21 Feb 2023US 11,589,457 B2KYOCERA Corporation
- Methods and system for controlled laser-driven explosive bonding17 Nov 2015US 9,192,056 B2Lawrence Livermore National Security, LLC
- Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board17 Jun 2014US 8,752,754 B2Showa Denko K. K.
- Joining method and reflow apparatus7 May 2013US 8,434,658 B2Fujitsu Limited
- Production method of solder circuit board28 Feb 2012US 8,123,111 B2Showa Denko K. K.
- Method for structuring metal-ceramic substrates, and structured metal ceramic substrate29 Feb 2024US 2024/0074064 A1Heraeus Deutschland GmbH & Co. KG
- Wiring board29 Apr 2021US 2021/0127486 A1KYOCERA Corporation
- Forced convection pre-heater for wave solder machine and related method30 Jul 2015US 2015/0216092 A1Illinois Tool Works Inc.
- Inkjet printer for printing on a three-dimensional object and related apparatus and method26 Dec 2013US 2013/0342592 A1Apple Inc.
- Methods and system for controlled laser-driven explosive bonding14 Mar 2013US 2013/0064993 A1Lawrence Livermore National Security, LLC
Most cited
By later US patents
- Methods and system for controlled laser-driven explosive bonding22US 9,192,056 B2Lawrence Livermore National Security, LLC · 2015
- Flow-over mass soldering18US 4,011,980 AWestern Electric Company, Inc. · 1977
- Process of coating the surface of a board17US 4,600,601 AAisin Seiki Kabushiki Kaisha · 1986
- Super-digital (SD) flash card with asymmetric circuit board and mechanical switch9US 7,476,105 B2Super Talent Electronics, Inc. · 2009
- Partial immersion flow coating method and apparatus8US 4,794,018 A1988