Methods and system for controlled laser-driven explosive bonding
AssigneeLawrence Livermore National Security, LLC
InventorsAlexander M. Rubenchik, Joseph C. Farmer, Lloyd Hackel, Jon Rankin
Life of this patent
Estimating the term…
Abstract
A technique for bonding two dissimilar materials includes positioning a second material over a first material at an oblique angle and applying a tamping layer over the second martial. A laser beam is directed at the second material that generates a plasma at the location of impact on the second material. The plasma generates pressure that accelerates a portion of the second material to a very high velocity and towards the first material. The second material impacts the first material causing bonding of the two materials.
Claims23
A method comprising:
- providing a substrate having an upper surface and an opposing lower surface;
- positioning a first material over the upper surface of the substrate at a first distance, the first material being positioned at an oblique angle with respect to the upper surface of the substrate;
- providing a tamping layer over the first material, wherein the tamping layer is characterized by a first thickness, wherein providing the tamping layer comprises flowing de-ionized water over the first material, the de-ionized water forming the tamping layer;
- directing a laser beam to be incident at a first location of the first material for a first duration;
- generating a first pressure at an interface region between the tamping layer and the first material;
- accelerating the first material to a first velocity and towards the upper surface of the substrate;
- and
- depositing the first material on at least a first portion of the upper surface of the substrate.
A method comprising:
- providing a substrate having a surface;
- placing a film comprising a first material at a first distance from the surface of the substrate;
- flowing a liquid over the film such that the liquid covers the film;
- providing laser energy at a first location of the film;
- generating a first pressure at an interface region of the liquid and the film proximate to the first location;
- accelerating the first material at the first location to a first velocity;
- directing the first material at the first location towards the surface of the substrate;
- causing the first material at the first location to impact the surface of the substrate in a first region;
- and
- bonding the first material at the first location to the first region of the surface, wherein bonding comprises:
- causing plastic deformation at the first region of the surface of the substrate;
- causing shear flow in the first region of the surface of the substrate;
- and
- intermixing of the first material at the first location with substrate material at the first region of the surface of the substrate.
A method of depositing a material, the method comprising:
- providing a substrate having an upper surface;
- positioning the material over and at an oblique angle with respect to the upper surface of the substrate;
- flowing a liquid over the material to form a tamping layer;
- directing a laser beam to be incident at a first location of the material;
- generating a pressure at an interface region between the tamping layer and the material;
- accelerating the material towards the upper surface of the substrate;
- and
- depositing the material on at least a first portion of the upper surface of the substrate.
Dependencies are inferred from the claim text.