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US 8,434,658 B2Granted
Joining method and reflow apparatus
AssigneeFujitsu Limited
InventorTetsuji Ishikawa
Life of this patent
Estimating the term…
Abstract
A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.
Claims10
A joining method, comprising:
- melting a hot melt joining material provided between a board and a component to be joined to the board in a first process vessel part;
- mounting a second process vessel part on the first process vessel part in which the hot melt joining material is in a molten state between the board and the component to be joined to the board to form a process vessel;
- and
- reducing a pressure of an ambient atmosphere of the hot melt joining material in the process vessel and tilting the board by tilting the process vessel while the hot melt joining material is in the molten state.
1 more element
Dependencies are inferred from the claim text.