Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board

A method for adhering solder powder to an adhesive portion of an electronic circuit board comprising:

• a preparation step of placing the solder powder on one side of the inside of a container and making a board holding portion inside the container hold the electronic circuit board with the adhesive portion such that a board surface thereof faces substantially a vertical direction with respect to a bottom face of the container;
• a first step of setting a tilted position where the container is tilted in a first direction as an initial position of the container, and tilting the container from the initial position to a second direction that is opposite to the first direction using a tilting device;
• and
• a second step of tilting the container again in the first direction,
• wherein at least one of the first step and the second step further comprises a step of rotating a rotating shaft of an eccentric motor of a vibrating device to cause vibration to a bottom portion of the container so that the solder powder moves to adhere to the adhesive portion of the electronic circuit board, wherein the vibrating device includes;
• the eccentric motor provided in the center of the bottom face of the container, and
• a control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container,
• wherein in the step of rotating the rotating shaft of the eccentric motor of the vibrating device to cause vibration to the bottom portion of the container, the vibrating device vibrates the container when the tilting device tilts the container.