Back to results
US 2021/0127486 A1Published application
Wiring board
AssigneeKYOCERA Corporation
InventorSeiichirou ITOU
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.
Claims16
A wiring substrate for mounting an electronic element, comprising:
- an insulating substrate comprising a corner constituted by two adjacent surfaces;
- wiring located continuously across the corner;
- wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.
Dependencies are inferred from the claim text.