H05K 2203/1581
Treating the backside of the pcb
Official title: Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
H05K2203/1581 (Treating the backside of the pcb) appears on 163 US grants and 134 published applications in this corpus.
Search patents in H05K- Granted patents
- 163
- Published applications
- 134
- Assignees
- 111
- Inventors
- 370
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 4 |
| 2002 | 9 | 10 |
| 2003 | 5 | 8 |
| 2004 | 10 | 9 |
| 2005 | 3 | 13 |
| 2006 | 7 | 15 |
| 2007 | 6 | 7 |
| 2008 | 8 | 10 |
| 2009 | 6 | 11 |
| 2010 | 7 | 5 |
| 2011 | 7 | 10 |
| 2012 | 8 | 2 |
| 2013 | 2 | 3 |
| 2014 | 2 | 2 |
| 2015 | 3 | 3 |
| 2016 | 5 | 4 |
| 2017 | 1 | 1 |
| 2018 | 3 | 3 |
| 2019 | 4 | 3 |
| 2020 | 1 | 0 |
| 2021 | 1 | 2 |
| 2022 | 1 | 3 |
| 2023 | 0 | 1 |
| 2024 | 3 | 3 |
| 2025 | 3 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus, system, and method for reinforcing solder joints by bracing corners of integrated circuit substrates10 Mar 2026US 12,575,024 B1Juniper Networks, Inc.
- Electronic device and display device using the same23 Dec 2025US 12,506,107 B2LG Display Co., Ltd.
- Manufacture of a curved electronic device using differential heating and curved electronic device1 Jul 2025US 12,349,272 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole1 Jul 2025US 12,349,287 B2Pac Tech—Packaging Technologies GmbH
- Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole2 Jul 2024US 12,028,987 B2Pac Tech—Packaging Technologies GmbH
- Solder joint cooling system6 Aug 2026US 2026/0231319 A1Delta Electronics (Thailand) Public Co., Ltd.
- Apparatus and Method for Establishing a Contact Connection24 Jul 2025US 2025/0235961 A1Pac Tech—Packaging Technologies GmbH
- Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole7 Nov 2024US 2024/0373563 A1Pac Tech—Packaging Technologies GmbH
- Electronic device and display device using the same19 Sep 2024US 2024/0312945 A1LG Display Co., Ltd.
- Method for preparing novel material layer structure of circuit board and article thereof22 Aug 2024US 2024/0284599 A1
Most cited
By later US patents
- Process for mounting electronic device and semiconductor device167US 6,208,525 B1Hitachi Hokkai Semiconductor, Ltd. · 2001
- Thick film and thin film composite substrate and electronic circuit apparatus using it137US 5,110,664 AHitachi, Ltd. · 1992
- Flip chip type semiconductor device and method for manufacturing the same132US 6,406,942 B2NEC Corporation · 2002
- Multilayer printed circuit board and method for fabricating same109US 5,451,721 AInternational Business Machines Corporation · 1995
- Printed circuit board with aligned connections and method of making same98US 5,450,290 AInternational Business Machines Corporation · 1995