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US 12,575,024 B1Granted
Apparatus, system, and method for reinforcing solder joints by bracing corners of integrated circuit substrates
AssigneeJuniper Networks, Inc.
InventorsOmar Ahmed, Peng Su, Bernard Glasauer
Life of this patent
Estimating the term…
Abstract
An apparatus may reinforce solder joints by bracing corners of integrated circuit substrates. To do so, an exemplary apparatus may include (1) a substrate of an integrated circuit coupled to a circuit board and (2) at least one corner reinforcement brace coupled to the circuit board and at least one corner of the substrate. Various other apparatuses, systems, and methods are also disclosed.
Claims14
An apparatus comprising:
- a substrate of an integrated circuit coupled to a circuit board;
- at least one corner reinforcement brace that is soldered to the circuit board via a reflow process and is coupled to at least one corner of the substrate;
- and
- a single mass of adhesive that:
- couples the corner of the substrate, the circuit board, and the corner reinforcement brace to one another;
- makes contact with the corner of the substrate, the circuit board, and the corner reinforcement brace;
- and
- fills a gap between the corner reinforcement brace and the corner of the substrate, wherein the gap measures between 0.1 millimeter and 5 millimeters.
5 more elements
A method comprising:
- placing, atop a circuit board, at least one corner reinforcement brace proximate to at least one corner of a substrate of an integrated circuit;
- soldering the corner reinforcement brace to the circuit board proximate to the corner of the substrate via a reflow process;
- and
- adhering, with a single mass of adhesive, the corner of the substrate, the circuit board, and the corner reinforcement brace to one another to strengthen one or more solder joints formed between the substrate and the circuit board, wherein the single mass of adhesive fills a gap between the corner reinforcement brace and the corner of the substrate and makes contact with the corner of the substrate, the circuit board, and the corner reinforcement brace.
1 more element
A system comprising:
- a circuit board;
- a substrate of an integrated circuit coupled to the circuit board;
- and
- a plurality of reinforcement braces that are soldered to the circuit board via a reflow process and are coupled to a plurality of corners of the substrate;
- and
- a single mass of adhesive that:
- couples one corner of the substrate, the circuit board, and one reinforcement brace to one another;
- makes contact with the one corner of the substrate, the circuit board, and the one corner reinforcement brace;
- and
- fills a gap between the one reinforcement brace and the one corner of the substrate.
7 more elements
Dependencies are inferred from the claim text.