H05K 2203/1572
Processing both sides of a pcb by the same process
Official title: Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
H05K2203/1572 (Processing both sides of a pcb by the same process) appears on 936 US grants and 927 published applications in this corpus.
Search patents in H05K- Granted patents
- 936
- Published applications
- 927
- Assignees
- 487
- Inventors
- 2,058
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 7 | 0 |
| 1984 | 3 | 0 |
| 1985 | 8 | 0 |
| 1986 | 10 | 0 |
| 1987 | 9 | 0 |
| 1988 | 6 | 0 |
| 1989 | 6 | 0 |
| 1990 | 10 | 0 |
| 1991 | 19 | 0 |
| 1992 | 17 | 0 |
| 1993 | 14 | 0 |
| 1994 | 16 | 0 |
| 1995 | 19 | 0 |
| 1996 | 18 | 0 |
| 1997 | 10 | 0 |
| 1998 | 22 | 0 |
| 1999 | 20 | 0 |
| 2000 | 15 | 0 |
| 2001 | 26 | 16 |
| 2002 | 46 | 25 |
| 2003 | 25 | 41 |
| 2004 | 35 | 61 |
| 2005 | 31 | 46 |
| 2006 | 32 | 87 |
| 2007 | 39 | 61 |
| 2008 | 51 | 73 |
| 2009 | 51 | 57 |
| 2010 | 37 | 57 |
| 2011 | 48 | 42 |
| 2012 | 37 | 40 |
| 2013 | 37 | 33 |
| 2014 | 32 | 35 |
| 2015 | 19 | 18 |
| 2016 | 23 | 13 |
| 2017 | 16 | 14 |
| 2018 | 8 | 9 |
| 2019 | 19 | 15 |
| 2020 | 10 | 16 |
| 2021 | 12 | 20 |
| 2022 | 10 | 19 |
| 2023 | 14 | 12 |
| 2024 | 15 | 12 |
| 2025 | 14 | 9 |
| 2026 | 4 | 96 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing printed circuit boards1 Sep 2026US 12,727,090 B2Gebr. Schmid GmbH & Co.
- Transparent circuit board9 Jun 2026US 12,652,761 B2Avary Holding (Shenzhen) Co., Limited.
- Flexible printed circuit board and method of manufacturing flexible printed circuit board26 May 2026US 12,641,723 B2Sumitomo Electric Industries, Ltd.
- Power supply module19 May 2026US 12,633,443 B2Delta Electronics (Shanghai) Co., Ltd.
- Coreless component carrier with embedded components2 Dec 2025US 12,490,382 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Pcb via design for power electronic applications and method for manufacturing30 Jul 2026US 2026/0223282 A1Mitsubishi Electric Corporation
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
- Local-Bias Adaptive Drive for Timing Stabilization in Pipelined Mixed-Precision Processing Elements16 Jul 2026US 2026/0203017 A1
Most cited
By later US patents
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems424US 5,663,901 ASanDisk Corporation · 1997
- Lead connections means for stacked tab packaged IC chips312US 5,138,438 AAkita Electronics Co., Ltd. · 1992
- Method for producing multilayer printed wiring boards247US 5,258,094 ANEC Corporation · 1993
- Apparatus for interconnecting multiple devices on a circuit board247US 6,434,016 B1Intel Corporation · 2002