Coreless component carrier with embedded components
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorAllen Zhao
Life of this patent
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Abstract
A coreless component carrier includes (a) a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure; and (b) a component embedded in the stack. At least one electrically insulating layer structure includes a reinforced layer structure, which is arranged at an outer main surface of the stack. Further described is a method for manufacturing such a coreless component carrier and preferably simultaneously a further coreless component carrier of the same type.
Claims20
A coreless component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and several electrically insulating layer structures;
- a component embedded in the stack;
- wherein at least one of the electrically insulating layer structures, which is arranged at an outer main surface of the stack is a reinforced layer structure, and wherein only the at least one electrically insulating layer structure arranged at the outer main surface of the stack is the reinforced layer structure;
- a recess formed in the stack, wherein the recess is defined by the electrically insulating layer structures such that the embedded component is entirely accommodated within the recess;
- and
- a solder resist layer formed at an outer surface of the reinforced layer structure,
- wherein the reinforced layer structure is located between the solder resist layer and another one of the several electrically insulating layer structures.
A method for manufacturing a coreless component carrier, the method comprising:
- providing a stack comprising at least one electrically conductive layer structure and several electrically insulating layer structures, the stack forming a recess defined by the electrically insulating layer structures;
- embedding a component within the stack, such that the component is entirely accommodated within the recess;
- wherein at least one of the electrically insulating layer structures, arranged at an outer main surface of the stack is a reinforced layer structure, and wherein only the at least one electrically insulating layer structure arranged at the outer main surface of the stack is the reinforced layer structure;
- and
- forming a solder resist layer at an outer surface of the reinforced layer structure,
- wherein the reinforced layer structure is located between the solder resist layer and another one of the several electrically insulating layer structures.
Dependencies are inferred from the claim text.