H05K 2203/1536
Temporarily stacked pcbs
Official title: Temporarily stacked PCBs
H05K2203/1536 (Temporarily stacked pcbs) appears on 240 US grants and 282 published applications in this corpus.
Search patents in H05K- Granted patents
- 240
- Published applications
- 282
- Assignees
- 91
- Inventors
- 533
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 8 |
| 2002 | 10 | 7 |
| 2003 | 8 | 10 |
| 2004 | 7 | 11 |
| 2005 | 8 | 6 |
| 2006 | 3 | 13 |
| 2007 | 8 | 17 |
| 2008 | 6 | 17 |
| 2009 | 8 | 22 |
| 2010 | 9 | 17 |
| 2011 | 11 | 32 |
| 2012 | 16 | 18 |
| 2013 | 16 | 14 |
| 2014 | 10 | 17 |
| 2015 | 17 | 26 |
| 2016 | 17 | 14 |
| 2017 | 10 | 6 |
| 2018 | 6 | 2 |
| 2019 | 1 | 3 |
| 2020 | 5 | 6 |
| 2021 | 3 | 4 |
| 2022 | 4 | 4 |
| 2023 | 5 | 2 |
| 2024 | 5 | 5 |
| 2025 | 3 | 0 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing printed circuit board2 Jun 2026US 12,648,086 B2Samsung Electro-Mechanics Co., Ltd.
- Semiconductor package and method of manufacturing the same14 Oct 2025US 12,444,689 B2Advanced Semiconductor Engineering, Inc.
- Printed circuit board18 Mar 2025US 12,256,501 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board4 Mar 2025US 12,245,375 B2LG Innotek Co., Ltd.
- Method for producing package substrate for mounting semiconductor device15 Oct 2024US 12,119,277 B2Mitsubishi Gas Chemical Company, Inc.
- Electronic Board with Plated Through Hole and Axial and Radial Annular Protrusions14 May 2026US 2026/0136472 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method19 Dec 2024US 2024/0422907 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method of manufacturing printed circuit board12 Dec 2024US 2024/0414849 A1Samsung Electro-Mechanics Co., Ltd.
- Semiconductor package and method of manufacturing the same27 Jun 2024US 2024/0213168 A1Advanced Semiconductor Engineering, Inc.
- Printed circuit board2 May 2024US 2024/0147634 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Method for fabricating thin touch sensor panels59US 7,918,019 B2Apple Inc. · 2011
- Antifuse interconnect between two conducting layers of a printed circuit board57US 5,962,815 AProlinx Labs Corporation · 1999
- Rigid-flex printed circuit49US 5,175,047 ATeledyne Industries, Inc. · 1992
- Multilayered circuit board and semiconductor device46US 8,227,703 B2Sumitomo Bakelite Co., Ltd. · 2012
- Mold compounds in improved embedded-die coreless substrates, and processes of forming same39US 8,264,849 B2Intel Corporation · 2012