Antifuse interconnect between two conducting layers of a printed circuit board

A structure comprising:

• a first electrode;
• a second electrode;
• and
• a dielectric layer located between said first electrode and said second electrode, said dielectric layer being formed of a first material said first material being non-conductive, said dielectric layer defining a hole, said hole being covered at least partially by said first electrode and by said second electrode;
• and
• a second material including at least one conductive particle and a dielectric material, said second material being sandwiched between said first electrode and said second electrode;
• wherein
• said first material is photoimagible and said first electrode and said second electrode are electrodes in a printed circuit board;
• and
• said conductive particle has a dimension approximately the diameter of said hole.

A structure comprising:

• a first electrode;
• a second electrode;
• and
• a dielectric layer located between said first electrode and said second electrode, said dielectric layer being formed of a first material said first material being non-conductive, said dielectric layer defining a hole, said hole being covered at least partially by said first electrode and by said second electrode;
• and
• a second material including at least one conductive particle and a dielectric material, said second material being sandwiched between said first electrode and said second electrode;
• wherein
• said first material is photoimagible and said first electrode and said second electrode are electrodes in a printed circuit board;
• and
• the conductive particle comprises an inner core and an outer layer surrounding said inner core, the inner core having a higher melting temperature than the outer layer.