Back to results
US 8,264,849 B2Granted
Mold compounds in improved embedded-die coreless substrates, and processes of forming same
AssigneeIntel Corporation
InventorJohn S. Guzek
Life of this patent
Estimating the term…
Abstract
An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus include an at least one stiffener layer that is integral to the coreless substrate and the stiffener layer is made of overmold material, underfill material, or prepreg material.
Claims29
An apparatus, comprising:
- a coreless substrate including a first surface and a second surface, wherein the coreless substrate includes interlayer dielectric materials of a first stiffness;
- a ball-grid pad array disposed on the first surface;
- an embedded die that is integral to the coreless substrate;
- and
- at least one stiffener layer of a second stiffness and that is integral to the coreless substrate, wherein the second stiffness is greater than the first stiffness.
2 more elements
A process comprising:
- applying at least one stiffener layer to an embedded-die coreless substrate to make the at least one stiffener layer integral thereto, wherein the embedded-die coreless substrate is abutting a second embedded-die coreless substrate, and wherein the embedded-die coreless substrate includes:
- a first surface and a second surface;
- interlayer dielectric materials of a first stiffness;
- a ball-grid pad array disposed on the first surface;
- an embedded die that is integral to the coreless substrate;
- and
- wherein the at least one stiffener has a second stiffness that is larger than the first stiffness;
- and
- singulating the embedded-die coreless substrate from the second substrate.
6 more elements
A computing system, comprising:
- a coreless substrate including a first surface and a second surface, wherein the coreless substrate includes interlayer dielectric materials of a first stiffness;
- a ball-grid pad array disposed on the first surface;
- an embedded die that is integral to the coreless substrate;
- and
- at least one stiffener layer of a second stiffness and that is integral to the coreless substrate, wherein the second stiffness is greater than the first stiffness;
- and
- a foundation substrate coupled to the coreless substrate.
4 more elements
Dependencies are inferred from the claim text.