US 12,245,375 B2 · Circuit board

Abstract

A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on an upper surface of the first insulating layer; a first circuit pattern buried in a lower region of the first insulating layer and including a first via pad; a second circuit pattern disposed between the first insulating layer and the second insulating layer and including a second via pad; a third circuit pattern buried in an upper region of the second insulating layer and including a third via pad; a first via disposed in the first insulating layer and connecting the first via pad and the second via pad; and a second via disposed in the second insulating layer and connecting the second via pad and the third via pad, and wherein at least one of an upper surface and a lower surface of the second via includes a convex portion in an upward or downward direction.

Claims20

Dependent claims

A circuit board comprising:

an insulating layer;
and
an electrode layer passing through the insulating layer,
wherein the electrode layer includes:
a first electrode;
a second electrode disposed on the first electrode;
and
a third electrode disposed between the first electrode and the second electrode and connecting the first electrode and the second electrode in a vertical direction;
wherein a width in a horizontal direction of the third electrode decreases toward the first electrode,
wherein a lower surface of the third electrode includes a first convex portion convex toward the first electrode,
wherein an upper surface of the first electrode includes a first concave portion concave toward a lower surface of the first electrode, and
wherein a width of the first concave portion in the horizontal direction is less than or equal to a width of the first convex portion in the horizontal direction.

9 more elements

Dependencies are inferred from the claim text.

Circuit board

Life of this patent

Circuit board

Life of this patent

Abstract

Claims20